1992
DOI: 10.1149/1.2069228
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Reductive Corrosion of ITO in Contact with Al in Alkaline Solutions

Abstract: Tin-doped indium oxide (ITO) layers show severe corrosion in alkaline solutions when they are in electrical contact with A1. This corrosion process is investigated by etching experiments, electrochemical measurements, and analytical techniques. It is shown that A1 maintains ITO at a cathodic potential where it is reduced. A1 itself is oxidized and dissolves as AlOe. The products of the ITO corrosion are most probably SnO~-, which dissolves in the solution, and In metal, which forms grains at the surface. This … Show more

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Cited by 29 publications
(12 citation statements)
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“…However, it is well known that the application of ITO as a transparent conducting layer is limited by its potential window. Outside of its potential limits, ITO degrades under extreme anodic or cathodic polarization and may lose conductivity and transparency. The literature provides extensively electrochemical investigations on the behavior of ITO under anodic and cathodic polarization. Meulenkamp et al reported the electrochemical behavior of ITO in a propylene carbonate (PC) solution and found that ITO undergoes irreversible reduction to metallic indium at potentials more negative than 1.0 V vs Li/Li + .…”
Section: Introductionmentioning
confidence: 99%
“…However, it is well known that the application of ITO as a transparent conducting layer is limited by its potential window. Outside of its potential limits, ITO degrades under extreme anodic or cathodic polarization and may lose conductivity and transparency. The literature provides extensively electrochemical investigations on the behavior of ITO under anodic and cathodic polarization. Meulenkamp et al reported the electrochemical behavior of ITO in a propylene carbonate (PC) solution and found that ITO undergoes irreversible reduction to metallic indium at potentials more negative than 1.0 V vs Li/Li + .…”
Section: Introductionmentioning
confidence: 99%
“…The cyclic potential window was set between À0.6 and 0.6 V. When the potential scan was carried out in the positive direction, oxygen evolved, and in the other direction, hydrogen evolved. 18,19 In this case, the on-set potentials of oxygen evolution and hydrogen evolution were seen at 0.6 V and À0.35 V, respectively. Fig.…”
Section: Resultsmentioning
confidence: 76%
“…Increasing the temperature catalyzes the reactions and the kinetic is favorable to Al vertical etching, enabling complete removal of the Al layer without horizontal spreading. Moreover, the Al etching rate might increase due to local corrosion elements which may take place at the interface Al nobler metal . Typical seed materials are Ag, Cu (both used in this work).…”
Section: Resultsmentioning
confidence: 99%
“…Moreover, the Al etching rate might increase due to local corrosion elements which may take place at the interface Al nobler metal. [28] Typical seed materials are Ag, Cu (both used in this work). The selective Cu electrodeposition is then performed onto the Cu-seed as observed in Figure 4b.…”
Section: Noble Processingmentioning
confidence: 99%