Reduction of Metal Oxides by Electron Cyclotron Resonance (ECR) Plasma of Hydrogen–A Model Study on Discharge Cleaning

Sakamoto, Yuichi; Ishibe, Yukio

doi:10.1143/jjap.19.839

Cited by 16 publications

(3 citation statements)

References 27 publications

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“…Experiments with mirrors of different types have added much to the results of paper [79] concerning the efficiency of removing oxide films of different thickness (δ) through the use of low-temperature hydrogen plasma, as is shown in Table 4. All new data (for BeO, Al 2 O 3 , WO 3 in comparison with the ones of ref [79]) were obtained by applying optical and ellipsometric methods in experiments with metal mirrors (Be, Al, W) and film mirrors (Al, Ag) protected with a dielectric film (Al 2 O 3 , ZrO 2 ).…”

Section: Removal Of Metal Oxidesmentioning

confidence: 99%

“…All new data (for BeO, Al 2 O 3 , WO 3 in comparison with the ones of ref [79]) were obtained by applying optical and ellipsometric methods in experiments with metal mirrors (Be, Al, W) and film mirrors (Al, Ag) protected with a dielectric film (Al 2 O 3 , ZrO 2 ). The data of Table 4 testify that copper oxide is the most easily removable film, while zirconium oxide film appears the most stable.…”

Section: Removal Of Metal Oxidesmentioning

confidence: 99%

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Experimental Simulation of the Behaviour of Diagnostic First Mirrors Fabricated of Different Metals for ITER Conditions

Voitsenya¹,

Bardamid²,

Donné³

2016

PHY

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In the experimental fusion reactor ITER, the plasma-facing component of each optical and/or laser diagnostic needs to be based on reflective optics with at least one mirror (first mirror) facing the thermonuclear plasma. The different kinds of radiation emanating from the burning plasma (neutrons, neutral atoms, electromagnetic radiation) create hostile operating conditions for the first mirrors. Therefore, a special program has been set up under the ITER framework aimed at solving the first mirror problem. This paper will review the main results in this field that have been obtained in the Institute of Plasma Physics, National Science Center “Kharkov Institute of Physics and Technology” (in many cases in cooperation with groups of other countries, as indicated in corresponding parts of the manuscript) during long-term investigations directed to find a solution of this problem,i.e., to find a material and accompanying precautions in order to satisfy the requirements for first mirrors. The main efforts were devoted to finding solutions to overcome the impact of the most severe deteriorating factors resulting in degradation of the optical properties of mirrors: sputtering by charge exchange atoms and deposition of contaminants. The obtained results are focused on: the effects of long term sputtering on mirror specimens fabricated from different metals with different structures (polycrystals, single crystals, metal film on metal substrates, amorphous), the effects of contaminating film and the possible protection to avoid of its appearance, the role of chemical processes for some metal mirrors, and the choice of material of laser mirrors.

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Section: Removal Of Metal Oxidesmentioning

confidence: 99%

Section: Removal Of Metal Oxidesmentioning

confidence: 99%

Experimental Simulation of the Behaviour of Diagnostic First Mirrors Fabricated of Different Metals for ITER Conditions

Voitsenya¹,

Bardamid²,

Donné³

2016

PHY

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“…Using hydrogen directly to reduce Cu oxide in the form of plasma is preferred since hydrogen plasma is known to be effective in reducing Cu oxide. 19) There have been many ways to exploit hydrogen plasma, [20][21][22][23][24] but only few research studies have been carried out for low-temperature Cu-Cu bonding, [25][26][27][28] which is important for three-dimensional (3D) IC applications, especially wafer-level manufacturing processes. 29) We expected that hydrogen plasma could both reduce surface oxide and activate the surface, which are critical for lowtemperature Cu-Cu bonding.…”

Section: Introductionmentioning

confidence: 99%

Effects of forming gas plasma treatment on low-temperature Cu–Cu direct bonding

Kim

Nam

Kim

2016

Jpn. J. Appl. Phys.

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Low-temperature Cu–Cu direct bonding becomes of great importance as Cu is widely used as an interconnection material in the packaging industry. Preparing a clean surface is a key to successful Cu–Cu direct bonding. We investigated the effects of forming gas plasma treatment on the reduction of Cu oxide and Cu–Cu bonding temperature. As plasma input power and treatment time increased, Cu oxide could be effectively reduced, and this could be attributed to the enhanced chemical reaction between forming gas plasma and Cu oxide. When the bonding temperature was reduced from 415 to 300 °C, the bonding strength of the plasma-treated interface was increased from 1.8 to 5.55 J/m2 while that of the wet-treated interface was decreased.

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