2022
DOI: 10.1002/app.52651
|View full text |Cite
|
Sign up to set email alerts
|

Reducing dynamic heat build‐up of styrene butadiene rubber/carbon black by filling aramid pulp coated with natural rubber latex

Abstract: The manufacture of green tires with low heat build‐up has attracted extensive attention. Furthermore, the trouble to solve the problem of rubber failure caused by tires dynamic heat build‐up is a great challenge faced by the automotive tire industry. In this article, a method of preparing styrene butadiene rubber/carbon black/aramid pulp‐natural rubber latex (SBR/CB/AP‐NRL) composites was described in detail, which used AP coated with NRL to fill SBR/CB. A flexible interface layer was constructed between fiber… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
5
0

Year Published

2022
2022
2023
2023

Publication Types

Select...
3

Relationship

1
2

Authors

Journals

citations
Cited by 3 publications
(5 citation statements)
references
References 33 publications
(34 reference statements)
0
5
0
Order By: Relevance
“…After NRL treated, a flexible interfacial layer was constructed on the fiber surface. The “deformation transfer” is formed 26 . That is, because silica can only be diffused into the interfacial layer and the content of silica in the interfacial layer is low, so that the modulus and the heat build‐up of interfacial layer are lower than rubber matrix, when dynamic deformation occurred in the composite, because the modulus of AP with high length‐diameter ratio is significantly higher than that of the rubber matrix, contributing to the drastic stress concentration on the fiber surface and the greater stress in the fiber interfacial layer than that in the rubber matrix.…”
Section: Resultsmentioning
confidence: 99%
See 3 more Smart Citations
“…After NRL treated, a flexible interfacial layer was constructed on the fiber surface. The “deformation transfer” is formed 26 . That is, because silica can only be diffused into the interfacial layer and the content of silica in the interfacial layer is low, so that the modulus and the heat build‐up of interfacial layer are lower than rubber matrix, when dynamic deformation occurred in the composite, because the modulus of AP with high length‐diameter ratio is significantly higher than that of the rubber matrix, contributing to the drastic stress concentration on the fiber surface and the greater stress in the fiber interfacial layer than that in the rubber matrix.…”
Section: Resultsmentioning
confidence: 99%
“…The "deformation transfer" is formed. 26 That is, because silica can only be diffused into the interfacial layer and the content of silica in the interfacial layer is low, so that the modulus and the heat build-up of interfacial layer are lower than rubber matrix, when dynamic deformation occurred in the composite, because the modulus of AP with high length-diameter ratio is significantly higher than that of the rubber matrix, contributing to the drastic stress concentration on the fiber surface and the greater stress in the fiber interfacial layer than that in the rubber matrix. Thus, the deformation of the interfacial layer is increased and the deformation of the rubber matrix is reduced, that is, part of the deformation of the matrix is transferred to the flexible interface layer with lower heat build-up.…”
Section: Dynamic Compression Heat Performance Analysismentioning
confidence: 99%
See 2 more Smart Citations
“…The friction between fillers and fillers and between fillers and rubber raise the temperature of the rubber composite. 51,52 Figure 7A shows the heat build-up of carbon black/rubber composites. The heat build-up decreased after the addition of M1, mainly because the polyether long chain was coated on the surface of carbon black, which promoted the dispersion of carbon black, thus reducing the friction between carbon black and between carbon black and rubber chain.…”
Section: The Heat Build-up Of Carbon Black/ Rubber Compositesmentioning
confidence: 99%