Redox agent enhanced chemical mechanical polishing of thin film diamond

Abstract

The chemical nature of the chemical mechanical polishing of diamond has been examined by adding various redox agents to the alkaline SF1 polishing slurry. Three oxidizing agents namely, hydrogen peroxide, potassium permanganate and ferric nitrate, and two reducing agents, oxalic acid and sodium thiosulfate, were added to the SF1 slurry. Oxalic acid produced the fastest polishing rate while hydrogen peroxide had very little effect on polishing, probably due to its volatile nature. X-ray photoelectron spectroscopy (XPS) reveals little difference in the surface oxygen content on the polished samples using various slurries. This suggests that the addition of redox agents do not increase the density of oxygen containing species on the surface but accelerates the process of attachment and removal of Si or O atoms within the slurry particles to the diamond surface

Contact resistance of various metallisation schemes to superconducting boron doped diamond between 1.9 and 300 K

“…In particular, the high Young's Modulus and superconductivity of boron doped nanocrystalline diamond (B-NCD) shows promise in the fabrication of superconducting nanoelectromechanical systems (NEMS) [3]. To ensure high quality factors NEMS require low surface roughness, which means that NCD films need to be polished [4][5][6]. Such devices need to operate below the critical temperature of the B-NCD, which has been shown to be approximately 4.2 K [7].…”

Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing

“…Scientific investigation of the processes underlying diamond polishing has been performed for a long time. Up to now, diverse polishing techniques based on different physical and chemical principles have been introduced, e.g., (i) mechanical polishing with diamond powder [6], (ii) chemical-mechanical polishing [7][8][9], (iii) laser smoothing [10], (iv) plasma etching [11][12][13], (v) molten eutectic [14], (vi) ion beam smoothing [15][16], (vii) high rate ultrasonic polishing with slurry [5] and even (viii) multi-step processing [17]. However, most processes are either time-consuming or complicated, and some are incapable of achieving the ultra-smooth surface required.…”

Research on abrasive pool machining method based on gas–solid two-phase flow

“…At present, the main nishing methods in the world are mechanical polishing, magnetorheological, electrorheological, magnetic levitation and chemical polishing. Sunil Jha [1], Anant Kumar Singh [2], Williams [3], Zone-Ching Lin [4] et al, respectively studied the magnetorheological polishing modeling, chemical mechanical polishing process, equipment development and other issues. But the above processing methods have obvious defects, such as mechanical polishing processing quality is low, poor processing e ciency; The electromagnetic processing is expensive and the cost is high, and the processing parts are also limited.…”