2020
DOI: 10.1016/j.diamond.2019.107600
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Subsurface cleavage of diamond after high-speed three-dimensional dynamic friction polishing

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Cited by 40 publications
(25 citation statements)
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“…3a is likely to be subsurface, which is not surprising as mechanical polishing is known to induce sub-surface damage. 46 There is also an increase in the C-O contribution from ~7% at 90° to ~13% at 30°, as a result of the lower collection angle being more surface sensitive; the O termination is only found at the surface of the BDD. Adventitious carbon signals are minimal.…”
Section: Surface Characterizationmentioning
confidence: 98%
“…3a is likely to be subsurface, which is not surprising as mechanical polishing is known to induce sub-surface damage. 46 There is also an increase in the C-O contribution from ~7% at 90° to ~13% at 30°, as a result of the lower collection angle being more surface sensitive; the O termination is only found at the surface of the BDD. Adventitious carbon signals are minimal.…”
Section: Surface Characterizationmentioning
confidence: 98%
“…Electronic grade single crystal CVD diamond wafers are scaif polished (a mechanical process where diamond particles are used to abrasively polish the wafer's surface) 45 . Imperfections caused by the polishing process can reach 10 µm below the polished surface 46 . It is hypothesised that this may have altered the electrical characteristics of the diamond resulting in the 4.5 µm thick deadlayer at the top of the detector.…”
Section: Electrical Characterisation and 63 Ni βSpectroscopymentioning
confidence: 99%
“…(a) SWLI image of the CVD-grown mosaic SCD substrate before PAP; (b) SWLI image of the mosaic SCD substrate after PAP for 3 h; (c) cross-sectional profile of the same point on the mosaic SCD substrate before and after PAP for 3 h; (d) photo of the mosaic SCD substrate before PAP; (e) photo of the mosaic SCD substrate after PAP for position and FWHM of the line are considered to be caused by the imperfection of the crystallinity from several reasons, for instance, impurity such as nitrogen in the mosaic SCD substrate 14 . When dynamic friction polishing (DFP), which has mechanical, thermal, and chemical effects as removal phenomena, was applied to polish SCD, the FWHM of diamond Raman line broadened from 2.7 to 5.49-9.75 cm −1 , indicating that subsurface damage (SSD) was formed on the surface of SCD 15 . When mechanical ultrasonic polishing using a water-based slurry with diamond grit was applied to polish the polycrystalline diamond (PCD), the FWHM of diamond Raman line broadened from 3.8 ± 0.7 to 5.3 ± 0.4 cm −1 .…”
Section: Crystallinity Of the Mosaic Scd (100) Substrate Surface Aftementioning
confidence: 99%