2015
DOI: 10.1002/adem.201500457
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Recrystallization Behavior at Diffusion Bonding Interface of High Nb Containing TiAl Alloy

Abstract: A series of diffusion bonding tests are conducted on a high Nb containing TiAl alloy with full lamellar (FL) microstructure and the effect of interfacial recrystallization behavior on the shear strength is discussed. Microstructural observations reveal that bonding above 1 100 C and 30 MPa results in recrystallization at the bonding interface flanked by FL microstructure, thus promoting the interface migration and leading to a sound joint. Based on the present results, the nucleation mechanism of recrystalliza… Show more

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Cited by 33 publications
(7 citation statements)
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“…We can find that the highest shear strength is 383MPa for the bonded joint which was produced with the parameters 1150℃ /30MPa/45min/0.062μm.This shear strength attains about 98% of the matrix materials. That similar shear strength value were also reported by Cam et al [15] for diffusion the gamma-TiAl alloys and Bin Tang et al [18] for the high Nb containing TiAl alloys. The fact that the shear strength of the bonding joints increase which was caused by the disappeared of the α 2 (Ti3Al) phase and the sufficient recrystallization at the diffusion bonding interface.…”
Section: Mechanical Properties Of the Diffusion Bonding Jointsupporting
confidence: 89%
“…We can find that the highest shear strength is 383MPa for the bonded joint which was produced with the parameters 1150℃ /30MPa/45min/0.062μm.This shear strength attains about 98% of the matrix materials. That similar shear strength value were also reported by Cam et al [15] for diffusion the gamma-TiAl alloys and Bin Tang et al [18] for the high Nb containing TiAl alloys. The fact that the shear strength of the bonding joints increase which was caused by the disappeared of the α 2 (Ti3Al) phase and the sufficient recrystallization at the diffusion bonding interface.…”
Section: Mechanical Properties Of the Diffusion Bonding Jointsupporting
confidence: 89%
“…Larger pressure and higher temperature were usually needed in the traditional solid-state diffusion bonding process. For example, the TiAl alloy solid-state diffusion bonding needs 1100 °C and 30 MPa . The extra heating energy and pressure, which would assist in bonding between different metals, were employed to accelerate the surface oxide removal, leading to plastic deformation and ultimately achieving solid-state diffusion bonding.…”
Section: Resultsmentioning
confidence: 99%
“…显然, 不同的再结晶机制势必影响界面的变形连接行为, 从 而影响连接效率和界面的力学性能. 然而, 虽然目前的 一些研究已表明界面动态再结晶行为对界面愈合具有 重要作用 [54] , 但关于界面处再结晶晶粒的形核以及长 [55] . 许多研究者针对冷态压力焊接区域进行了 表征, 以定量研究破碎区域大小对界面结合质量的影 响 [47,56] .…”
Section: 的快速成型 而且由于每次增加的材料在成分、组织unclassified