“…Charge trapping is also inserted in a phenomenological manner, in agreement with the observed square-root dependence on N C [221,222], resulting in the following expression for the average number of electrons being trapped at cycle N C :…”
Section: Modelsmentioning
confidence: 70%
“…Figure 21 shows instead the dependence on the bake conditions: note that the detrapping dynamics depend on the time t 0 elapsing between the last program and the first read operation (left-hand side), resulting in a shift of the detrapping curve along the log-time axis by a quantity exactly equal to t 0 . Also, ∆V T depends upon the bake temperature T B (right-hand side of Figure 21), demonstrating that detrapping is thermally activated: the ∆V T curves at different T B are shifted according to an Arrhenius law with activation energy E A ≈ 1.1 eV [221,222,228,229], a single detrapping curve can be obtained for an equivalent T B . This value of activation energy had been also observed in earlier retention experiments [51].…”
Section: Charge Detrappingmentioning
confidence: 94%
“…Moreover, as charge is trapped into the oxide during P/E cycling and detrapped in-between, a dependence on the cycling pattern arises, which complicates the development of comprehensive models. Such task began in [221,222] and developed into a full model accounting for the major experimental evidence in [223][224][225]. Figure 19 shows experimental data from a retention experiment at room temperature on a 16 nm NAND vehicle after 10 4 P/E cycles [226].…”
Section: Charge Detrappingmentioning
confidence: 99%
“…We start this Section with the description of a compact model [221,222,226] that captures the main features of the data and can be used for some first-order extrapolations, while moving to more refined descriptions of the underlying physics later on. To this aim, we assume a log-time dependence of the V T shift that, considering that the first read operation is performed at time t 0 after the end of the cycling phase, leads to…”
Abstract:We review the state-of-the-art in the understanding of planar NAND Flash memory reliability and discuss how the recent move to three-dimensional (3D) devices has affected this field. Particular emphasis is placed on mechanisms developing along the lifetime of the memory array, as opposed to time-zero or technological issues, and the viewpoint is focused on the understanding of the root causes. The impressive amount of published work demonstrates that Flash reliability is a complex yet well-understood field, where nonetheless tighter and tighter constraints are set by device scaling. Three-dimensional NAND have offset the traditional scaling scenario, leading to an improvement in performance and reliability while raising new issues to be dealt with, determined by the newer and more complex cell and array architectures as well as operation modes. A thorough understanding of the complex phenomena involved in the operation and reliability of NAND cells remains vital for the development of future technology nodes.
“…Charge trapping is also inserted in a phenomenological manner, in agreement with the observed square-root dependence on N C [221,222], resulting in the following expression for the average number of electrons being trapped at cycle N C :…”
Section: Modelsmentioning
confidence: 70%
“…Figure 21 shows instead the dependence on the bake conditions: note that the detrapping dynamics depend on the time t 0 elapsing between the last program and the first read operation (left-hand side), resulting in a shift of the detrapping curve along the log-time axis by a quantity exactly equal to t 0 . Also, ∆V T depends upon the bake temperature T B (right-hand side of Figure 21), demonstrating that detrapping is thermally activated: the ∆V T curves at different T B are shifted according to an Arrhenius law with activation energy E A ≈ 1.1 eV [221,222,228,229], a single detrapping curve can be obtained for an equivalent T B . This value of activation energy had been also observed in earlier retention experiments [51].…”
Section: Charge Detrappingmentioning
confidence: 94%
“…Moreover, as charge is trapped into the oxide during P/E cycling and detrapped in-between, a dependence on the cycling pattern arises, which complicates the development of comprehensive models. Such task began in [221,222] and developed into a full model accounting for the major experimental evidence in [223][224][225]. Figure 19 shows experimental data from a retention experiment at room temperature on a 16 nm NAND vehicle after 10 4 P/E cycles [226].…”
Section: Charge Detrappingmentioning
confidence: 99%
“…We start this Section with the description of a compact model [221,222,226] that captures the main features of the data and can be used for some first-order extrapolations, while moving to more refined descriptions of the underlying physics later on. To this aim, we assume a log-time dependence of the V T shift that, considering that the first read operation is performed at time t 0 after the end of the cycling phase, leads to…”
Abstract:We review the state-of-the-art in the understanding of planar NAND Flash memory reliability and discuss how the recent move to three-dimensional (3D) devices has affected this field. Particular emphasis is placed on mechanisms developing along the lifetime of the memory array, as opposed to time-zero or technological issues, and the viewpoint is focused on the understanding of the root causes. The impressive amount of published work demonstrates that Flash reliability is a complex yet well-understood field, where nonetheless tighter and tighter constraints are set by device scaling. Three-dimensional NAND have offset the traditional scaling scenario, leading to an improvement in performance and reliability while raising new issues to be dealt with, determined by the newer and more complex cell and array architectures as well as operation modes. A thorough understanding of the complex phenomena involved in the operation and reliability of NAND cells remains vital for the development of future technology nodes.
“…Electrons capture and emission events at charge trap sites near the interface developed over P/E cycling directly result in memory cell threshold voltage random fluctuation, which is referred to as random telegraph noise (RTN) [13,14]; http://asp.eurasipjournals.com/content/2012/1/203 2. Interface state trap recovery and electron detrapping [12,15] gradually reduce memory cell threshold voltage, leading to the data retention limitation. This is referred to as data retention noise.…”
Semiconductor technology scaling makes NAND flash memory subject to continuous raw storage reliability degradation, leading to the demand for more and more powerful error correction codes. This inevitable trend makes conventional BCH code increasingly inadequate, and iterative coding solutions such as low-density parity-check (LDPC) codes become very natural alternative options. However, fine-grained soft-decision memory sensing must be used in order to fully leverage the strong error correction capability of LDPC codes, which results in significant data access latency overhead. This article presents a simple design technique that can reduce such latency overhead. The key is to cohesively exploit the NAND flash memory wear-out dynamics and impact of LDPC code structure on decoding performance. Based upon detailed memory device modeling and ASIC design, we carried out simulations to demonstrate the potential effectiveness of this design method and evaluate the involved trade-offs.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.