Reconfigurable Vacuum Sample Holder for Through-Silicon Microscopy and Laser-Assisted Bonding

Vlasov, Aleksandr Andreevich; Uusitalo, Topi; Virtanen, Heikki; Viheriälä, Jukka; Guina, Mircea

doi:10.1109/jphot.2023.3302404

Cited by 3 publications

(2 citation statements)

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“…The proposed machine-vision based temperature sensor is validated for photonic integration assembly processes. The detailed review on LAB in the fields of microelectronics and photonics is presented in [13].…”

Section: Discussionmentioning

confidence: 99%

“…2). This design allows simultaneous observation, alignment, and irradiation of the silicon sample, placed on the custom transparent sample holder [13] during LAB process, which is highly beneficial for scientific and R&D applications. To suppress the environmental noise and vibrations impacts, the sample holder and the setup itself are mounted on a solid rigid basis with the use of properly designed vibration isolation system [14].…”

Section: Experimental Setup and Methodsmentioning

confidence: 99%

See 1 more Smart Citation

Laser-Assisted Bonding Approach for Photonic Integration Processes

Vlasov,

Uusitalo,

Lepukhov

et al. 2024

IMAPSource Proceedings

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Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, and silicon photonics. To this end, on-chip integration using siliconphotonics platform offers a wide range of possibilities addressing passive optics functionality, active optoelectronic devices, and compatibility with CMOS fabrication. On the other hand, the hybrid technology enabling volume manufacturing of such system-on-chip components it is still in an early development stage. In this work, the original LAB setup with a coaxial bottom irradiation architecture was developed. The setup allows a rapid and energy-effective process with the ability to produce successful electrical bonds with negligible thermalinduced stress and warpage to bonded surfaces. The proposed machine-vision based temperature sensor is validated for photonic integration assembly processes.

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Section: Discussionmentioning

confidence: 99%

Section: Experimental Setup and Methodsmentioning

confidence: 99%