Laser-Assisted Bonding Approach for Photonic Integration Processes

Abstract

Current development trends concerning miniaturizing of electronics and photonics systems are aiming at assembly and 3D co-integration of a broad range of technologies including MEMS, microfluidics, wafer level optics, and silicon photonics. To this end, on-chip integration using siliconphotonics platform offers a wide range of possibilities addressing passive optics functionality, active optoelectronic devices, and compatibility with CMOS fabrication. On the other hand, the hybrid technology enabling volume manufacturing of such system-on-chip components it is still in an early development stage. In this work, the original LAB setup with a coaxial bottom irradiation architecture was developed. The setup allows a rapid and energy-effective process with the ability to produce successful electrical bonds with negligible thermalinduced stress and warpage to bonded surfaces. The proposed machine-vision based temperature sensor is validated for photonic integration assembly processes.