Reconfigurable 4 × 4 Switch Matrix for Ka-Band Geo-Stationary Satellite Mission

Kaleem, Saqib; Humbla, Stefan; Müller, Jens; Rentsch, S.; Stöpel, Dirk; Hein, Matthias

doi:10.1515/freq-2012-0105

Cited by 2 publications

(1 citation statement)

References 11 publications

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“…A 4×4 reconfigurable switch matrix at Ka-band downlink frequencies (17...22 GHz) has been developed in a public research project related to the German geostationary satellite mission 'Heinrich Hertz' [1]. The PINdiodes based multiple-throw switches are hybrid integrated on a multi-layer ceramic substrate using the low temperature co-fired ceramic (LTCC) technology.…”

Section: Introductionmentioning

confidence: 99%

A package-level implementation of traveling-wave switch using PIN-diodes

Kaleem

Rentsch

Humbla

et al. 2013

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems

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A single-pole single-throw switch constituting the transparent path in a reconfigurable switch matrix is presented, improving the availability of the switch matrix in case of an on-board power-fail. The design of the switch is based on the traveling-wave concept using packaged PIN-diodes on a thickfilm ceramic substrate under the constraints on the number of PIN-diodes and power dissipation. The circuit design and analysis of the switch based on the concept of an artificial transmissionline are described. Unlike the traditional low-pass characteristics inherent to traveling-wave switches, high isolation is achieved by transforming the parasites of the PIN-diodes in the shunt arms to reveal band-pass characteristics besides assisting the assembly of the package. On-wafer measurements reveal an isolation ≥ 45 dB and an insertion loss ≤ 6 dB in the Ka-band downlink frequencies (17...22 GHz).

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Section: Introductionmentioning

confidence: 99%

A package-level implementation of traveling-wave switch using PIN-diodes

Kaleem

Rentsch

Humbla

et al. 2013

2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems

Self Cite

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Thermal analysis, design, and characterization of a reconfigurable switch matrix based on LTCC technology for satellite communications

Kaleem

Rentsch

Welker

et al. 2014

International Symposium on Microelectronics

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The thermal characteristics of a reconfigurable switch matrix (RSM) module based on low temperature co-fired ceramic (LTCC) technology are presented. Owing to the PIN-diodes based design, a static power of 1.6 W is dissipated on the ceramic package; the double-sided mounting and integrated bias circuitry demands determination of the temperature distribution within the module. A finite-element thermal simulation model was validated by an infrared (IR) thermograph; the steady-state temperature distribution on the surface of the package estimated by the simulation model differs to the IR measurements by < 1%. This temperature distribution is the result of the thermal interaction among components on the multi-die package with different electrical power dissipation. The temperature on the multi-throw switch monolithic microwave integrated circuit (MMIC) is elevated by ~36.7 K relative to the ambient temperature. The peak temperature occurs on the current-limiting resistors in the bias circuitry; the peak temperature is estimated to be ~45 K above the ambient. In a later version of the RSM, the bias current was reduced by 50%, current-limiting resistor was replaced by two parallel resistors, and additional thermal vias and conductive pads were introduced on the ceramic package. The cumulative effect is a temperature distribution on the package with lowered values. Compared to its predecessor, the temperatures at the current-limiting resistor and the MMIC are reduced by ~20 K and ~14 K, respectively. With one heat source active on the ceramic package at a time, the resulting steady-state temperatures on this source and the remaining heat sources provided an estimate of the self- and transfer-thermal resistances, respectively. The reciprocity of the heat flow on the package and the three-dimensional symmetric layout required only ‘4’ thermal simulations to determine the symmetric thermal resistance matrix. The significantly reduced values of the computed matrix for the later version of the RSM module demonstrated lower thermal resistance to the ambient, compared to its predecessor. Lastly, the results of thermal measurements conducted with a vacuum wafer prober are presented, in order to validate RSM functionality for vacuum pressures (≤ 1 mPa) and temperatures between 248 K and 338 K; the control current and the transmission coefficient demonstrated variations of ≤ 0.5% and −0.015 dB/K, respectively.

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Reconfigurable 4 × 4 Switch Matrix for Ka-Band Geo-Stationary Satellite Mission

Cited by 2 publications

References 11 publications

A package-level implementation of traveling-wave switch using PIN-diodes

A package-level implementation of traveling-wave switch using PIN-diodes

Thermal analysis, design, and characterization of a reconfigurable switch matrix based on LTCC technology for satellite communications

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