A package-level implementation of traveling-wave switch using PIN-diodes

Abstract

A single-pole single-throw switch constituting the transparent path in a reconfigurable switch matrix is presented, improving the availability of the switch matrix in case of an on-board power-fail. The design of the switch is based on the traveling-wave concept using packaged PIN-diodes on a thickfilm ceramic substrate under the constraints on the number of PIN-diodes and power dissipation. The circuit design and analysis of the switch based on the concept of an artificial transmissionline are described. Unlike the traditional low-pass characteristics inherent to traveling-wave switches, high isolation is achieved by transforming the parasites of the PIN-diodes in the shunt arms to reveal band-pass characteristics besides assisting the assembly of the package. On-wafer measurements reveal an isolation ≥ 45 dB and an insertion loss ≤ 6 dB in the Ka-band downlink frequencies (17...22 GHz).