Recent Progress of EDC Commercialization in Addressing Datacom and Telecom Challenges to Enable High-speed Optical Enterprise, Metro and Long-haul Networks

Status of Industry Efforts to Deploy EDC and Advanced Modulation Schemes for Extended Reach Transport Applications

“…EDC using CMOS technology has been previously proposed [1] to compensate for optical channel multi-path modal, chromatic and polarization-mode dispersions. The first success of EDC commercial deployment with significant shipping volume in term of X2/SFP+ form factors [1][2] has been identified in enterprise networks to upgrade the large installed base of legacy MMFs running at 1Gb/s. Its optical interfaces were specified by 10GBASE-LRM (long-reach multimode) ratified by IEEE 802.3aq task force [3] for serial 10 GbE over worst-case legacy MMF (OM1) up to 220m.…”

“…Both x-cut MZ modulator and EML have been tested with good results. The EDC chips tested were based on variants of mixed signal FFE and/or DFE implementations [1][2] to meet the cost and power budget of the Small Form Factor (SFF) modules. Different EDC chips are annotated as X, Y, and Z.…”

Performance demonstration of 300-km dispersion uncompensated transmission using tunable chirp-managed laser and EDC integratable into small-form-factor MSAs

“…This is the common platform for multi-mode fiber, single-mode fiber and backplane applications, and has been widely deployed in enterprise applications. The details of the FFE/DFE-based EDC structure can be found elsewhere [5]. Several implementation trade-offs has been considered.…”

“…In the receive side, the last several years have witnessed the introduction and commercialization of FFE/DFEbased EDC techniques for intersymbol interference (ISI) mitigation in optical networks [5]. The FFE (feed-forward equalizer) combined with DFE (decision-feedback equalizer) realized within one IC provides a rational balance between good performance and additional aspects that have to be considered for modular applications: i.e., size, power consumption and cost.…”

“…Chirp managed laser (CML) provides high optical output power, long transmission distance in standard single-mode fibers. In addition, this new transmitter requires a low driving voltage and, by eliminating the external modulator offers a reduced footprint, which fits into a small form factor XFP TOSA (Transmitter Optical Sub-Assembly) package.In the receive side, the last several years have witnessed the introduction and commercialization of FFE/DFEbased EDC techniques for intersymbol interference (ISI) mitigation in optical networks [5]. The FFE (feed-forward equalizer) combined with DFE (decision-feedback equalizer) realized within one IC provides a rational balance between good performance and additional aspects that have to be considered for modular applications: i.e., size, power consumption and cost.…”