Recent advances in SAW packaging

Selmeier, P.; Grünwald, R.; Przadka, A.; Krüger, H.; Feiertag, G.; Ruppel, C.C.W.

doi:10.1109/ultsym.2001.991627

Cited by 35 publications

(21 citation statements)

References 4 publications

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“…As a practical example, the technique was utilized to lower the noise floor in our first measurement results regarding BAW transmission properties of an acoustic mirror presented in our conference paper [85] and as a part of data presented in an invited paper [86]. The filtering was [92]. To enable components without packaging, boundary waves are studied as a potential candidate for highperformance, temperature compensated chip-size components [93,94].…”

Section: Filtering Of Wave Field Data In Wave-vector Domainmentioning

confidence: 99%

Measurement of evanescent wave properties of a bulk acoustic wave resonator [Letters]

Kokkonen

Meltaus

Pensala

et al. 2012

IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

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Aalto University publication series DOCTORAL DISSERTATIONS 112/2014 © Kimmo Kokkonen AbstractThe research summarized in this dissertation focuses on the development of a heterodyne scanning laser interferometer and of data-analysis techniques for the characterization and analysis of the surface vibration fields in microacoustic devices and test structures.The heterodyne laser interferometer enables a phase-sensitive, absolute-amplitude detection of the out-of-plane component of a surface vibration field, with a minimum detectable amplitude of less than a picometer, while the lateral resolution is better than 1 micrometer. The instrument features a flat frequency response up to 6 GHz.The phase-sensitive absolute-amplitude data enables the visualization of the actual wave behavior in electromechanical components and test structures, but more importantly, it is the basis for further analysis. The research instrument is applied to the study of electroacoustic devices based on surface acoustic wave (SAW) and bulk acoustic wave (BAW) technologies. Two novel SAW devices are studied in detail: a phononic crystal (PnC) structure and a scattering structure resulting in a random wave field. PnCs are acoustic metamaterials that can provide engineered material properties. The laser interferometric measurements were amongst the first to directly characterize the wave interaction with the PnC. SAW slowness curves of an anisotropic substrate material are extracted by measuring and analyzing the scattered random wave field. Data analysis methods are developed further in the context of BAW research by experimentally addressing two important aspects of device design: the correct operation of the acoustic reflector used to confine the energy in the resonator, and investigation of the role of the dispersion and standing wave resonances to the spurious responses often observed in high-Q resonators. Fourier transform techniques are used for selective visualization of wave fields and for the extraction of the dispersion characteristics of the plate-waves. The dispersion data are then further used to analyze the transfer characteristics of an acoustic reflector and to study the properties of lateral eigenresonances and the lateral energy confinement in detail.The research described in this thesis provides a detailed characterization of the operation of SAW and BAW devices and effects within, highlighting and further developing the experimental characterization capabilities and data-analysis methods.Keywords laser interferometry, microacoustics, surface acoustic waves, bulk acoustic waves Tiivistelmä Väitöskirjatyö käsittelee heterodyne-tyyppisen laserinterferometrin sekä interferometrin tuottaman datan analyysitekniikoiden kehittämistä pintavärähtelykenttien karakterisoimiseksi ja analysoimiseksi mikroakustisissa komponenteissa ja testirakenteissa.Työssä rakennettu heterodynelaserinterferometri mahdollistaa pintavärähtelyiden vaiheherkät absoluuttiamplitudimittaukset aina 6 GHz taajuuteen asti. Laitteisto kykenee värähtely-kenttien k...

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Section: Filtering Of Wave Field Data In Wave-vector Domainmentioning

confidence: 99%

Measurement of evanescent wave properties of a bulk acoustic wave resonator [Letters]

Kokkonen

Meltaus

Pensala

et al. 2012

IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

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“…where T is the temperature, t the time, and α the thermal diffusivity defined as α = k ρ · c p (2) in which the parameters k, c p , and ρ are respectively the thermal conductivity, the specific heat at a constant pressure and the material density.…”

Section: Thermo-mechanical Simulationsmentioning

confidence: 99%

“…Therefore it is difficult to integrate them monolithically on a semiconductor chip. In the literature there are three kinds of packages that have been analysed, classified into ceramic, metal and plastic packages [2]. Recently, the development of flip-chip technology [3,4] has led to chip-scale packages and wafer-level packages, which enhance miniaturization and reduce the cost of the assembly [5].…”

Section: Introductionmentioning

confidence: 99%

A SAW filter integrated on a silicon passive substrate used for system in package

Georgel¹,

Verjus²,

Grunsven³

et al. 2008

Sensors and Actuators A: Physical

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“…These CSP packages have weak structural points due to thermal expansion coefficient differences caused by having more than two materials in contact with one another. [1,4,6] The chip scale package structure of the SAW filter in this study is shown in Fig. 1.…”

Section: A Package Structurementioning

confidence: 99%

“…Each packaging type has certain strengths and weaknesses in terms of cost, process difficulty, and reliability. [1] Cost reduction requires the development of a low-cost process, raw material, and process reduction. Study on the proper selection of materials and optimization of its structure must precede the development of small and durable products.…”

Section: Introductionmentioning

confidence: 99%

Development of the RF SAW filters based on PCB substrate

Lee

2006

2006 IEEE International Frequency Control Symposium and Exposition

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Recently produced RF SAW(Surface Acoustic Wave) filters are made using HTCC(High Temperature Cofired Ceramic) with CSP(Chip Scale Package) technology. This paper describes the development of a new 1.4 × 1.1 and 2.0 × 1.4 mm RF SAW filter based on PCB(Printed Circuit Board) substrate instead of HTCC package, which reduces the cost of materials by 40%. We have investigated the multilayered PCB substrate structure and raw materials to determine the optimal flip-bonding condition between the LiTaO 3 wafer and PCB substrates. Also, optimal materials and processing conditions for the epoxy laminating film were experimentally determined that can reduce the bending moment caused by thermal expansion differences between the PCB substrate and laminating film. The new PCB SAW filter shows better electrical and reliability performances than those observed with present SAW filters.

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Recent advances in SAW packaging

Cited by 35 publications

References 4 publications

Measurement of evanescent wave properties of a bulk acoustic wave resonator [Letters]

Measurement of evanescent wave properties of a bulk acoustic wave resonator [Letters]

A SAW filter integrated on a silicon passive substrate used for system in package

Development of the RF SAW filters based on PCB substrate

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