Recent advances in nano-materials for packaging of electronic devices

Zhang, Shuye; Xu, Xiangyu; Lin, Tiesong; He, Peng

doi:10.1007/s10854-019-01790-3

Cited by 100 publications

(37 citation statements)

References 76 publications

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“…e SEM is a qualitative observation, and the MIP is a quantitative description of pores in the soil. ese two methods have been widely used by researchers to study the microstructure of intact or compacted loess [19][20][21] and other research field [22]. Figure 4 shows the MIP test results.…”

Section: Microstructure Characteristics Of Compacted Loess Specimensmentioning

confidence: 99%

Microstructure of Compacted Loess and Its Influence on the Soil‐Water Characteristic Curve

Xie

Hou

et al. 2020

Advances in Materials Science and Engineering

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Soil-water characteristic curve (SWCC) is a key constitutive relationship for studying unsaturated soil, and as is known, microstructure of the soil has great influence on the mechanical behaviour of the soil. In this study, the wetting and drying soil-water characteristic curves (SWCCs) of loess compacted at three different water contents were measured using the filter paper method. And microproperties of compacted loess were obtained by the mercury intrusion method (MIP) and scanning electron microscope (SEM). Results show that the compaction water contents have significant influence on the SWCC and microstructure. The pore size distribution (PSD) curves have great differences in macropore range and are similar in micropore range. Loess compacted at optimum and dry of optimum are generally connected, while there are certain number of nonintruded pores in loess compacted at wet of optimum. The SWCC curves vary significantly in low suction (ua − uw < 1000 kPa) and tend to converge together in high suction (ua − uw ≥ 1000 kPa). Hysteresis in the SWCCs is more obvious for loess compacted at optimum and dry of optimum in the matric suction of 0∼100 kPa; however, there is a pronounced hysteresis for loess compacted at wet of optimum in full matric suction range. The characteristic of the SWCCs including their hysteresis can be well interpreted from the loess microstructure.

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Section: Microstructure Characteristics Of Compacted Loess Specimensmentioning

confidence: 99%

Microstructure of Compacted Loess and Its Influence on the Soil‐Water Characteristic Curve

Xie

Hou

et al. 2020

Advances in Materials Science and Engineering

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“…Silver nanoparticles (AgNPs) have been applied in a wide range of elds including medicine, clothing, catalysis, soldering and electronics. [1][2][3][4] Zhang et al prepared nano-Ag-coated Cu particles and applied them in electrically conductive adhesives. 2 Wang et al reported a mixture of silver nanowires and AgNP-coated copper for exible electronics.…”

Section: Introductionmentioning

confidence: 99%

Polysaccharides derived from Enteromorpha prolifera for the removal of silver nanoparticle-humic acid contaminants by a coagulation-ultrafiltration process

et al. 2020

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“…Kovar alloy is a Fe-Ni-Co alloy with Fe as the main matrix element, and its expansion coefficient is similar to that of silicon-boron hard glass; therefore, Kovar alloy and glass sealing are widely used in the field of electronic packaging related to in-candescent lamps, electron tubes, and housing for semi-conductors [12]. However, Kovar alloy has high density, which is increasingly difficult to meet the light-weight requirements for modern electronic packaging [13]. Therefore, a new type of electronic packaging material is required.…”

Section: Introductionmentioning

confidence: 99%

Low Temperature Sealing Process and Properties of Kovar Alloy to DM305 Electronic Glass

Wang

Gao

Chu

et al. 2020

Metals

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The low temperature sealing of Kovar alloy to DM305 electronic glass was realized by using lead-free glass solder of the Bi2O3-ZnO-B2O3 system in atmospheric environment. The sealing process was optimized by pre-oxidation of Kovar alloy and low temperature founding of flake glass solder. The effects of sealing temperature and holding time on the properties of sealing joint were studied by means of X-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDS), etc. The results showed that the pre-oxidized Kovar alloy and DM305 electronic glass were successfully sealed with flake glass solder at the sealing temperature of 500 °C for 20 min. Meanwhile, the joint interface had no pores, cracks, and other defects, the shear strength was 12.24 MPa, and the leakage rate of air tightness was 8 × 10−9 Pa·m3/s. During the sealing process, element Bi in glass solder diffused into the oxide layer of Kovar alloy and DM305 electronic glass about 1 μm, respectively.

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Recent advances in nano-materials for packaging of electronic devices

Cited by 100 publications

References 76 publications

Microstructure of Compacted Loess and Its Influence on the Soil‐Water Characteristic Curve

Microstructure of Compacted Loess and Its Influence on the Soil‐Water Characteristic Curve

Polysaccharides derived from Enteromorpha prolifera for the removal of silver nanoparticle-humic acid contaminants by a coagulation-ultrafiltration process

Low Temperature Sealing Process and Properties of Kovar Alloy to DM305 Electronic Glass

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