Recent advances in drop-impact reliability

A review of board level solder joints for mobile applications

“…Further evidence of fatigue as the micro-damage mechanism was provided by Seah et al [35] and Wong et al [38] in their reports of the PCB strain (S) to cycles-to-failure (N) characteristics of solder joints. A prevalence of fatigue damage of solder joints is observed for the range of PCB strain amplitudes between 1000 and 3000 micro-strain (Fig.…”

“…Conclusive evidence of fatigue as the micro-damage mechanism was provided by Caers et al [55] and Wong et al [38] in their investigation of the crack propagation in the solder joints of a PCB assembly subjected to cyclic bending at a PCB strain amplitude of 1800 micro-strain and bending frequency 100 Hz. Stable crack propagation was observed with increasing bending cycles (Fig.…”

“…Experimental evidence for the dependence of the fatigue life of solder joints on the bending frequency of PCB, which is related to bending mode, were provided by Seah et al [35] and Wong et al [38], respectively. Fig.…”

“…A comprehensive study comparing BIST and BLDST was also performed under the same consortium consisting of Institute of Microelectronics, Philips/NXP, Freescale, and ASE [36,38,54]. BIST was performed at two shear speeds of 0.5 m/s and 1 m/s.…”

“…A comprehensive study correlating the BLDST and the HSCBT was performed under a consortium consisting of the Institute of Microelectronics, Philips/NXP, Freescale, and ASE [36][37][38]. Two separate studies were performed.…”