2022
DOI: 10.1039/d1ee03883d
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Realizing high thermoelectric performance in non-nanostructured n-type PbTe

Abstract: Nanostructure engineering has improved the performance of thermoelectric materials, but the deteriorated stability of the materials at high temperatures shortens the service life of thermoelectric modules. Here, we realized a...

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Cited by 68 publications
(55 citation statements)
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References 60 publications
(94 reference statements)
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“…Several techniques, such as electron-hole doping [ 3 , 4 ], strain engineering, forming a layered structures, effect of resonant levels [ 5 ], etc., have been used to enhance the value of ZT. The various efficient bulk thermoelectrics include Heusler materials [ 6 , 7 , 8 , 9 ], phonon glass and electron crystals (PGEC) [ 10 , 11 ], pentatellurides [ 12 ], clathrates [ 13 ], chalcogenides [ 14 ], skutterudite [ 15 ], oxides [ 16 ], and tin selenide [ 17 ], etc., which have low thermal conductivity and high electrical properties.…”
Section: Introductionmentioning
confidence: 99%
“…Several techniques, such as electron-hole doping [ 3 , 4 ], strain engineering, forming a layered structures, effect of resonant levels [ 5 ], etc., have been used to enhance the value of ZT. The various efficient bulk thermoelectrics include Heusler materials [ 6 , 7 , 8 , 9 ], phonon glass and electron crystals (PGEC) [ 10 , 11 ], pentatellurides [ 12 ], clathrates [ 13 ], chalcogenides [ 14 ], skutterudite [ 15 ], oxides [ 16 ], and tin selenide [ 17 ], etc., which have low thermal conductivity and high electrical properties.…”
Section: Introductionmentioning
confidence: 99%
“…52,53 Additionally, the electronegativity of S is much larger than that of Te, leading to the higher bond energy of Ge−S to limit the formation of the Ge vacancy. 15 For the carrier mobility, μ H is obviously improved because the carrier scattering is severely reduced by the decreased n H and the similarity between the Cu−Te bond and the Ge−Te bond after substitution.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…From Table , n H and μ H decreased and increased with the Cu 2 S addition, respectively. The Cu 2 S addition generates substitution–interstitial defect pairs to improve the Ge vacancy formation energy in the GeTe-based materials, and the interstitial Cu + has a donor effect to decrease the hole concentration. , Additionally, the electronegativity of S is much larger than that of Te, leading to the higher bond energy of Ge–S to limit the formation of the Ge vacancy . For the carrier mobility, μ H is obviously improved because the carrier scattering is severely reduced by the decreased n H and the similarity between the Cu–Te bond and the Ge–Te bond after substitution.…”
Section: Resultsmentioning
confidence: 99%
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