Realization of Ultra Fine Pitch Traces on LCP Substrates

Dean, Robert N.; Weller, J.; Bozack, Michael J.; Rodekohr, C.L.; Farrell, Brian; Jauniskis, Linas; Ting, Joseph; Edell, David J.; Hetke, J.F.

doi:10.1109/tcapt.2008.916790

Cited by 20 publications

(14 citation statements)

References 9 publications

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“…The primary difference is that the substrate is a thin flexible material, such as the polyimide film Kapton [24] or liquid crystal polymer (LCP) [25]. FPCB material systems are similar to rigid PCBs, and FPCBs can be patterned with Cu on one or both sides, or they can be multilayered.…”

Section: B Flexible Pcb Technologymentioning

confidence: 99%

Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology

Dean¹,

Hamilton²,

Baginski³

2014

Journal of Microelectronics and Electronic Packaging

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AbstractÀCapacitive fringing field sensors are often used in applications where moisture is detected, since the dielectric constant of liquid water is approximately 80 times greater than the dielectric constant of air. Most of these sensors, however, are realized using rigid substrates. Some applications would benefit from using a flexible capacitive fringing field sensor that could be conformally mounted on a nonplanar surface. Flexible printed circuit board technology is a mature commercially available process for manufacturing flexible electronics. This same technology can also be used to realize flexible fringing field moisture sensors where the patterned Cu foil is used for the electrodes and the soldermask coating electrically insulates the electrodes from being electrically shorted by moisture in the detection environment. Sensors were designed and characterized through flat and bending tests in air and in water. The tests demonstrated that bending a sensor over a radius of curvature as small as 13.7 mm had no measurable impact on sensor performance in air or in water. The sensors achieved a 3:1 increase in capacitance when immersed in water compared with in air.

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Section: B Flexible Pcb Technologymentioning

confidence: 99%

Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology

Dean¹,

Hamilton²,

Baginski³

2014

Journal of Microelectronics and Electronic Packaging

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“…[4][5][6][7][8][9][10][11][12][13][14][15][16] The approaches can be summarized into two types: surface pre-treatment and the addition of an adhesion-promoting layer on the smooth surface.…”

Section: Technologies To Enhance Adhesion Strengthmentioning

confidence: 99%

Metallization Technologies on a Smooth Resin Surface for the Next Generation of Flip Chip Packaging

Horiuchi

Yamasaki

Shimizu

2010

Transactions of The Japan Institute of Electronics Packaging

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To realize higher wiring density, both finer line/space resolution and a smoother resin-metal interface are needed. These requirements, however, conflict to each other: sufficiently fine lines are difficult to form on a rough surface, while a smooth surface generally results in poor peel strength. The feasibility of various metallization processes that promote adhesion on smooth resin surfaces is examined. Their practical applicability to manufacturing high wiring-density packages is also assessed and the related issues that need to be improved are discussed.

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“…[2][3][4] Lamination and coating routes including electroless plating, electroplating, sputtering and chemical vapor deposition are usually applied to produce Cu-coated LCP films. [5][6][7][8][9][10][11][12] Compared with coating routes, the disadvantage of lamination routes is that it is difficult to achieve a thick metal layer and the lamination cost of copper foil is high. 5 Therefore, coating routes have attracted much more attention in recent years.…”

Section: Introductionmentioning

confidence: 99%

“…[10][11][12][13] Among all the coating methods, electroless plating is a relatively simple and energy saving as well as low cost method. 6,13,14 Generally, electroless copper plating solution consists of copper sulfate, reducing agent, complexing agent and other additives. Among them, reducing agent plays a critical role and hence has been investigated widely in electroless copper plating.…”

Section: Introductionmentioning

confidence: 99%

Electroless Copper Plating on Liquid Crystal Polymer Films Using Dimethylamine Borane as Reducing Agent

Zhang

Ding

2016

J Chinese Chemical Soc

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Dimethylamine borane (DMAB) was used in electroless copper plating on liquid crystal polymer (LCP) films. An orthogonal test was applied to optimize the plating condition. With Cu film resistivity as the evaluation index, the optimum plating condition is: 10 g/L of CuSO 4 ×5H 2 O, 14 g/L of EDTA-2Na, 6 g/L of DMAB, 9.5 of pH value and 50°C. As pH value increases, the Cu film resistivity decreases and the deposition rate increases. As temperature increases, the Cu film resistivity decreases first and then increases with a minimum at 50°C while the deposition rate increases first and then decreases with a maximum at 50°C. The decreased Cu film resistivity can be attributed to the occurrence of CuO. The adhesive strength of copper layer to LCP film is constant at pH values lower than 8.5 and decreases slightly with the increase in pH value. As temperature increases, the adhesive strength decreases slightly. The decreased adhesive strength with both pH and temperature may be a result of an increased corrosion attack from the bath to the surface of LCP films. Low Cu film resistivity and high deposition rate as well as high adhesive strength can be obtained using DMAB reducing agent.

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Realization of Ultra Fine Pitch Traces on LCP Substrates

Cited by 20 publications

References 9 publications

Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology

Capacitive Fringing Field Moisture Sensors Implemented in Flexible Printed Circuit Board Technology

Metallization Technologies on a Smooth Resin Surface for the Next Generation of Flip Chip Packaging

Electroless Copper Plating on Liquid Crystal Polymer Films Using Dimethylamine Borane as Reducing Agent

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