2016
DOI: 10.1002/jccs.201500412
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Electroless Copper Plating on Liquid Crystal Polymer Films Using Dimethylamine Borane as Reducing Agent

Abstract: Dimethylamine borane (DMAB) was used in electroless copper plating on liquid crystal polymer (LCP) films. An orthogonal test was applied to optimize the plating condition. With Cu film resistivity as the evaluation index, the optimum plating condition is: 10 g/L of CuSO 4 ×5H 2 O, 14 g/L of EDTA-2Na, 6 g/L of DMAB, 9.5 of pH value and 50°C. As pH value increases, the Cu film resistivity decreases and the deposition rate increases. As temperature increases, the Cu film resistivity decreases first and then inc… Show more

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Cited by 11 publications
(10 citation statements)
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“…The application of hypophosphite or hydrazine appears to be possible only at elevated temperatures, which limits their use in practice. In addition, boron-containing compounds, in particular dimethylamine borane (DMAB), are frequently used in chemical deposition processes [ 44 , 56 ]. In addition to the three covalent bonds with hydrogen, DMAB contains boron combined with trivalent nitrogen through the unshared electron pair of nitrogen by the donor-acceptor bonding mechanism.…”
Section: Resultsmentioning
confidence: 99%
“…The application of hypophosphite or hydrazine appears to be possible only at elevated temperatures, which limits their use in practice. In addition, boron-containing compounds, in particular dimethylamine borane (DMAB), are frequently used in chemical deposition processes [ 44 , 56 ]. In addition to the three covalent bonds with hydrogen, DMAB contains boron combined with trivalent nitrogen through the unshared electron pair of nitrogen by the donor-acceptor bonding mechanism.…”
Section: Resultsmentioning
confidence: 99%
“…: electroless template synthesis) [3] с использованием шаблонных матриц различной природы: пористых полимерных трековых мембран (ТМ) [4,5], анодированной окиси алюминия [6], углеродных НТ [7] и волокон [8]. В литературе встречаются данные об использовании различных восстановителей темплатного ХО меди: формальдегид [2], аскорбиновая [9,10] или глиоксиловая [11][12][13] кислоты, гидразингидрат [14], гипофосфит [15] и диметиламин-боран [16,17] и др. При комнатной температуре реакция восстановления ионов меди (II) возможна лишь при использовании формальдегида в качестве восстановителя.…”
Section: Introductionunclassified
“…The use of boron-based reducing agents, , such as DMAB or BH 4 – , in EL Cu baths represents another alternative to HCHO. However, these reducing agents also present issues that limit their usage.…”
Section: Elementsmentioning
confidence: 99%
“…Zhang and Ding have addressed the issue of complex interactions among DMAB bath components by employing an orthogonal L 9 (3) 4 statistically designed experiment to optimize bath stability and performance. They report a performance-optimized pH 9.5 EL Cu bath containing 40 mM CuSO 4 , 40 mM Na 2 EDTA, and 40 mM DMAB that plates an EL Cu film at 50 °C onto an oxidized liquid crystalline polymer film catalyzed by Pd/Sn colloid at a rate of 2.21 μm·h –1 competitive with a corresponding HCHO bath.…”
Section: Elementsmentioning
confidence: 99%
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