Reactive Evaporation of Metal Wire and Microdeposition of Metal Oxide Using Atmospheric Pressure Reactive Microplasma Jet

Abstract

We developed a safe technique without using a toxic gas source to deposit tungsten oxide on a localized specific area using an atmospheric pressure microplasma jet. In this technique, a consumable tungsten wire, inserted into a quartz nozzle for microplasma generation, was etched with an O2/Ar microplasma, and the resultant tungsten oxide was deposited on the substrate placed downstream. The process mechanism was determined by the detailed observation of the deposit and consumed wire surface after processing, and optical emission spectroscopy. This technique is expected to be utilized for the localized deposition of a variety of metal oxides by varying the kind of consumable metal wire.

Metal nanoparticle‐hydrogel nanocomposites for biomedical applications – An atmospheric pressure plasma synthesis approach

“…Non‐thermal Atmospheric Pressure Plasma (AMP), is an emerging technology that is receiving an increasing interest in the biomedical field. When water or other liquids are exposed to AMP, the chemistry induced at the plasma/liquid interface has demonstrated unique opportunities for the synthesis and surface functionalization of various nanomaterials including Si nanocrystals, nanocarbon structures, metal NPs such as Au and Ag, alloy NPs such as Au x Ag 1‐x , and metal oxide NPs such as F 3 O 4 and Cu 2 O …”

Nanomaterials synthesis at atmospheric pressure using nanosecond discharges

“…For the dc arc of (Chen et al 2007), we refer to (Reiche et al 2001), who measure the temperatures of a similar dc arc in argon at 1 atm. (Mariotti et al 2007;Mariotti 2008;Mariotti et al 2008;Stauss et al 2010) microplasma 1400*~1000~50000* (Shimizu et al 2006;Mariotti et al 2007;Mariotti 2008;Stauss et al 2010) spark 1500*~10000~80000* (Reinmann et al 1997;Akishev et al 2007;Tabrizi et al 2009) mw torch 7200* 3000 20000 (Chen et al 2002;Chen et al 2003) dc arc 50000* 8000 12000 (Reiche et al 2001;Chen et al 2007) From Table 2, we see that there is no correlation between gas temperature and energy cost. High energy costs of about 50 keV/atom are obtained at both T g = 2000 K and 8000 K. Low energy costs of about 1 keV/atom are obtained at both T g = 1000 K and 10000 K. On the other hand, the energy cost decreases with increasing electron temperature.…”

“…Table 2 shows the electron temperature (T e ) and the gas temperature (T g ) of some of the plasma sources presented in Table 1, when such information is provided or can be estimated from studies with similar experimental conditions. The estimates of the temperatures for the microplasmas of (Shimizu et al 2006;Mariotti et al 2008) are based on parametric studies of essentially the same plasma source by (Mariotti et al 2007;Mariotti 2008;Stauss et al 2010). Similar experimental conditions to the spark of (Tabrizi et al 2009) can be found in (Reinmann et al 1997;Akishev et al 2007), who simulate T g for sparks in atmospheric pressure N 2 .…”

“…For the microplasma used by (Nozaki et al 2007), (Mariotti et al 2010) estimates m & = 1 µg/min. For the microplasma used by (Shimizu et al 2006), we calculate m & based on the given dimensions of the nanoparticle tower and the density of bulk WO 3 . For the spark discharge used by (Tabrizi et al 2009), m & is equated to the rate of electrode mass loss.…”

Effect of Hydrogen Reduction on Characteristics of Cu Thin-Films Deposited by RF-Driven Ar/H$_{2}$ Atmospheric Pressure Plasma Jet

“…Recently, the various kinds of thin-film deposition methods have been also developed using the atmospheric pressure plasma with carrier gas containing a source material for deposition. [1][2][3][4][5][6] Especially, as for the Cu film deposition using atmospheric pressure plasma, however, there are few reports to our knowledge. There are some issues in the Cu film deposition for electronic devices in air.…”