2009
DOI: 10.1016/j.actamat.2009.02.021
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Reactive diffusion in nanostructures of spherical symmetry

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Cited by 31 publications
(22 citation statements)
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“…[50,51] However,i nc ase of more complex materials, such as oxides,i ti sv ery rare that lattice resolution can be achieved, and only in af ew studies of non-metallic materials were lattice plane reconstructions obtained. [52,53] To exploit the resolution limit of atom probe reconstructions and to identify lattice planes in LMO,aFFT analysis of local distances from reconstructed atoms to an arbitrary reference plane was performed in this study as recently proposed.…”
Section: Experimental Section Materialsmentioning
confidence: 99%
“…[50,51] However,i nc ase of more complex materials, such as oxides,i ti sv ery rare that lattice resolution can be achieved, and only in af ew studies of non-metallic materials were lattice plane reconstructions obtained. [52,53] To exploit the resolution limit of atom probe reconstructions and to identify lattice planes in LMO,aFFT analysis of local distances from reconstructed atoms to an arbitrary reference plane was performed in this study as recently proposed.…”
Section: Experimental Section Materialsmentioning
confidence: 99%
“…In addition, if the sample geometry is closed ͑cylindrical, spherical samples͒, since the stress free strain fields are long range fields, the stress development and relaxation will certainly depend on the shape and size of the sample and for example a radius dependence of the processes are also expected. 4,5 In extreme circumstances even a switching between the Darken and Nernst-Planck limits can be observed. 5 In the latter regime the intermixing is controlled by the diffusion of the slower component.…”
mentioning
confidence: 99%
“…4,5 In extreme circumstances even a switching between the Darken and Nernst-Planck limits can be observed. 5 In the latter regime the intermixing is controlled by the diffusion of the slower component. 4,5 Precursor experiments of hollow nanoshell formations were carried out by Aldinger 6 and by the Geguzin group.…”
mentioning
confidence: 99%
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“…Due to the annealing process, the Al-Cu/Kapton alloys suffered thermal stresses as observed by curling of the samples. The residual stress is assumed to arise from shrinkage of the substrate up to 1% at 673 K (as reported by the supplier) and by the thermal diffusion of the material [13][14][15][16]. Additionally, 50 nm thick Figure 2, where a sample pressed by the clamps is shown (Figure 2 were examined by atomic force microscopy (AFM).…”
Section: Alloys Preparation and Substrate Selectionmentioning
confidence: 99%