Elastic Modulus Determination of Al‐Cu Film Alloys Prepared by Thermal Diffusion

Huerta, Enrique Otero; Oliva, A.I.; Avilés, F.; González‐Hernández, J.; Corona, J.E.

doi:10.1155/2012/895131

Cited by 11 publications

(4 citation statements)

References 30 publications

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“…Hence, the Cu dome wall is no longer elastic. 13,14 Consequently, the Cu dome should begin to deform plastically when θ approaches 20°. Then cracks should appear along the dome periphery because ductile fractures of Cu mostly occur in the strain range larger than 0.1.…”

Section: Resultsmentioning

confidence: 99%

Mechanical Failure of Cu Current Collector Films Affecting Li Plating/Stripping Cycles at Cu/LiPON Interfaces

Motoyama¹,

Ejiri²,

Nakajima³

et al. 2023

J. Electrochem. Soc.

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This study examines an electro-chemo-mechanical theory that the nucleation overpotential (ηnc) for the Li nucleation at the Cu current collector (CC) film/lithium phosphorus oxynitride (LiPON) electrolyte interface is influenced by mechanical work to deform the CC film. The finite element method was used to simulate the mechanical pressure that the CC film exerted on the Li nuclei at the Cu/LiPON interface, and the results were in agreement with those in our previous study. By in-situ scanning electron microscopy observation for cycling of Li plating/stripping, it was found that Li was repeatedly nucleated and grew at positions where the CC film was locally fractured, and the ηnc decreased with repetition of Li plating/stripping. This was because the mechanical pressure to the Li nuclei was no longer applied at locations where the CC film was fractured. On the other hand, when thicker CC films that did not induce any cracks were used, the ηnc exhibited nearly consistent values even after repeating Li plating/stripping. Consequently, the experimental results obtained in this study supported our nucleation theory for a metal/solid-state-electrolyte interfacial system.

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Section: Resultsmentioning

confidence: 99%

Mechanical Failure of Cu Current Collector Films Affecting Li Plating/Stripping Cycles at Cu/LiPON Interfaces

Motoyama¹,

Ejiri²,

Nakajima³

et al. 2023

J. Electrochem. Soc.

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“…The pristine Al foil was prepared via the cold rolling method, which would unavoidably produce mechanical inhomogeneity and exhibit a rough surface (Ra = 0.05 µm) and a heterogeneous Young's modulus distribution ( Figure a,b), which will be difficult to form uniform alloy layer with lithium ions. However, the Cu–Al@Al foil shows a smoother surface (Ra = 0.02 µm) and more homogenous distribution of the Young's modulus with values of ≈80 GPa, which is in the range between the elastic modulus of bulk Al (≈70 GPa) and Cu (≈130 GPa) . The Young's modulus (GPa) versus depth curves are shown in Figure S4b in the Supporting Information, indicating the uniformity of the nanocomposite layer in the depth.…”

Section: Methodsmentioning

confidence: 96%

Uniform Distribution of Alloying/Dealloying Stress for High Structural Stability of an Al Anode in High‐Areal‐Density Lithium‐Ion Batteries

et al. 2019

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relative low theoretical capacity of graphite anode (372 mAh g −1 ) hinders the development of LIBs with higher energy density. [2] Therefore, exploiting anode materials with high capacity are drawing increasing attention. [3] Alloying anode materials, such as Si, Sn, and Al, show great potential due to their high theoretical capacity (4200 mAh g −1 as Li 4.4 Si for Si, [4] 990 mAh g −1 as Li 4.4 Sn for Sn, [5] and 2235 mAh g −1 as Li 2.25 Al for Al [6] ). Particularly, Al is a promising candidate anode due to its excellent conductivity, high theoretical capacity, low discharge potential, natural abundance, and especially low cost. [7] However, Al-based anodes are usually investigated in half cells or full cells with low cathode areal density (<2 mg cm −2 ), which are far from practical requirements. [8] For example, Al-based anodes, such as thin film, [9] nanowires, [10] yolk-shell nanoparticles, [6b] Al-Si-graphite composite, [11] and Al/C hybrid nanoclusters, [12] were paired with Li metal to assemble half cells. Even though core-shell Al@C nanospheres, [13] Al foil, [14] carbon coated porous Al foil, [6a] and bubble sheet-like interfacial layer protected Al foil [15] were reported as anode in full cells with excellent cycling stability, the reported areal density of cathodes were very low (1-2 mg cm −2 ). In practical application, it is still a challenge to maintain the structural stability of Al-based anodes when they are paired with high areal density of cathode materials (>5 mg cm −2 ) in a full cell. [16] But, the cathode with high areal density means high areal capacity, and which results in severe volume expansion and pulverization of Al anode. The decay of anode would destroy the integrity, and accelerate the failure of the full battery. [17] Recently, we found that the cracking and pulverization of the Al battery could be attributed to the uneven charge/discharge reaction along the boundaries of pristine Al ( Figure S1a,b, Supporting Information), which lead to the stress concentration and ultimate failure of Al anode ( Figure S1c, Supporting Information). Therefore, it is possible to extend the lifetime of Al anode via uniform distribution of the alloying/dealloying stress. Herein, we report an inactive (Cu)/active (Al) nanocomposite design to achieve homogeneous reaction of Al anode. When the as-prepared Cu-Al-modified Al (namely Cu-Al@Al) anode Aluminum (Al) is one of the most attractive anode materials for lithium-ion batteries (LIBs) due to its high theoretical specific capacity, excellent conductivity, abundance, and especially low cost. However, the large volume expansion, originating from the uneven alloying/dealloying reactions in the charge/ discharge process, causes structural stress and electrode pulverization, which has long hindered its practical application, especially when assembled with a high-areal-density cathode. Here, an inactive (Cu) and active (Al) codeposition strategy is reported to homogeneously distribute the alloying sites and disperse the stress of volume expans...

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“…These simulations have assumed that both the conductor and substrate have a linear elastic stress response and, thus, more complex effects such as creep have been neglected. Such an assumption has been made about polyimide materials based on the stress-strain relationship reported in [ 48 , 49 ]. The material properties relevant to this discussion can be found in Table 5 .…”

Section: Methodsmentioning

confidence: 99%

Proof of Concept Novel Configurable Chipless RFID Strain Sensor

Gee

Anandarajah

Collins

2021

Sensors

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This paper contains two main areas of research: First, this work outlines a novel, highly sensitive strain sensor design that should support various levels of deformation, depending on the substrate type used. Physical implementations in this work have focused on proving its large deformation capabilities, and simulations have been used to assess its more general electromagnetic response. The other part of this paper focusses on exploring other effects that will impact the sensing of strain of resolutions below 10 με, which is a capability achieved by other aerospace-grade strain sensor technologies. These effects are limited to mechanical swelling and sensor orientation in the azimuth and elevation planes, as these appear to be unexplored and highly relevant issues to the topic of chipless RFID-based strain sensing. From this exploration, it is apparent that the effects of mechanical swelling and sensor orientation (amongst others) will need to be addressed in any real-life implementation of the sensor, requiring a strain resolution below 10 με.

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Elastic Modulus Determination of Al‐Cu Film Alloys Prepared by Thermal Diffusion

Cited by 11 publications

References 30 publications

Mechanical Failure of Cu Current Collector Films Affecting Li Plating/Stripping Cycles at Cu/LiPON Interfaces

Mechanical Failure of Cu Current Collector Films Affecting Li Plating/Stripping Cycles at Cu/LiPON Interfaces

Uniform Distribution of Alloying/Dealloying Stress for High Structural Stability of an Al Anode in High‐Areal‐Density Lithium‐Ion Batteries

Proof of Concept Novel Configurable Chipless RFID Strain Sensor

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