Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

Park, Jong‐Hwan; Lee, Jong‐Hyun; Lee, Yong-Ho; Kim, Yong-Seog

doi:10.1007/s11664-002-0007-9

Cited by 22 publications

(3 citation statements)

References 19 publications

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“…e same phenomenon could be observed in the Au-Sn/Ni solder joint [33]. In the as-soldered Au-Sn/Ni solder joint, a thick δ layer and a thin (Au, Ni) 3 Sn 2 layer formed at the interface [34]. During the aging test, the Ni atom migrated from the substrate and reacted with the δ phase, forming the (Au, Ni)Sn IMC layer.…”

Section: Interfacial Microstructuresupporting

confidence: 66%

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

et al. 2020

Advances in Materials Science and Engineering

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With the development of electronical technology and the construction of the fifth-generation cellular networks, electronic devices with higher integrated level and power are widely applied. Hence, greater demands are being placed on electronic packaging materials. High-Pb solder alloys were widely used for low- and medium-temperature soldering for the past decades but have been prohibited due to toxicity. Au-based solder alloys with proper melting and mechanical properties show great potential to replace high-Pb solder alloys and are being emphasized recently. But in comparison with Pb-containing solder alloys, the investigation on novel Au-based solder alloys is quite insufficient, and their performance and reliability are still unclear. In this paper, the recent research studies on Au-based solder alloys with low temperature and medium temperature were reviewed and their microstructure, mechanical performance, and reliability were introduced and analyzed. Moreover, the novel processing technologies of Au-based solder alloys were discussed and compared.

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Section: Interfacial Microstructuresupporting

confidence: 66%

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

et al. 2020

Advances in Materials Science and Engineering

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“…There are many kinds of lead-free solders available in different manufacturing processes, such as Sn-Ag-Cu, Sn-Ag, SnCu, Sn-Zn and Sn-Au solder. Commonly used in wave and reflow soldering processes, these lead-free solders have a much higher melting temperature, comparing with Sn37Pb solder whose melting point is around 183°C [1][2][3]. Therefore, the utilization of lead-free technology inevitably raises the cost of manufacturing and damages the hightemperature-sensitive print circuit boards and components.…”

Section: Introductionmentioning

confidence: 99%

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Sun

Chan

2014

J Mater Sci: Mater Electron

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Sn-Bi solder was proposed as one of the most promising substitutes for lead solder due to its lower melting temperature, good wettability, good yield strength and cost efficiency. With Ag elements added, the mechanical properties of Sn-Bi solder were improved obviously. There are two ways that are commonly used to add the reinforced particles into the solder. The first way (Way I) is to blend the reinforced particles with solder powders together, and then followed by pressure forming, sintering, cooling, crystallization and serious machining methods under inert atmosphere to make the solder paste. Another way (Way II) is to directly add the reinforced nano or micro particles into the solder paste by sufficient mechanical-stirring. In this research we would like to get fully understanding on the effects of these two ways of Ag addition on the mechanical properties of Sn-Bi-Ag solder joints during aging. Sn57.6Bi0.4Ag solder stands for the Way I and the doped Sn58Bi ? 0.4Ag solder stands for the Way II. These two kinds of joints were compared via micromorphology observation, thermal failure analyses as well as balls shear strength measurement after different aging time (under 100°C, from 0 to 800 h). The mechanical properties of Sn57.6Bi0.4Ag and the doped Sn58Bi ? 0.4Ag solder joints during aging were shown to be associated with the changes of micromorphology, the dissolution of IMCs, as well as the flatness of the joints' interface. Before long-time aging, the doped Sn58Bi ? 0.4Ag solder joints showed better mechanical performance than Sn57.6Bi0.4Ag solder joints. During aging, Sn56.7Bi0.4Ag solder joints had better performance in preventing the dissolution of Ni-Sn IMCs into the solder side, having smoother interfaces, comparing with Sn58Bi ? 0.4Ag solder joints. The degenerated phenomenon of Ag nanoparticle reinforcement seriously happened in the doped Sn58Bi ? 0.4Ag solder joints. After longtime aging, Sn57.6Bi0.4Ag solder joints had better mechanical properties than the doped Sn58Bi ? 0.4Ag solder joints.

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“…Discontinuous interfacial IMC were formed during AuSn solder react with the Pt substrate, and there are localized Pt elements that dissolve into the molten solder during reflow. 53) The reaction behavior of Ni and Pt is similar, but the AuSn/Co solder joint forms continuous reaction products at a slower reaction rate, making Co more suitable than Pt and Ni as a blocking material for AuSn eutectic solder in optoelectronic packages.…”

Section: Interfacial Reactionsmentioning

confidence: 99%

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Wang

Zhang

2022

Mater. Trans.

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The requirements for electronic devices in high-temperature environment such as avionics and automotive have promoted the development of high-temperature solders. The Au20Sn solder, which is one of the hot topics of the current research in the field of electronic packaging, is widely used in flip-chip, light-emitting diode and hermetic package fields because of its good creep resistance, corrosion resistance and flux-free soldering. Recent research about the microstructure, wettability, interfacial intermetallic compounds, and mechanical properties of Au20Sn solder were reviewed. This paper focuses on the interfacial reaction of Au20Sn with different substrates and the mechanical properties of Au20Sn solder joints. In addition, the current research shortages of Au20Sn solders and the development directions are presented.

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Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages

Cited by 22 publications

References 19 publications

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

Novel Au‐Based Solder Alloys: A Potential Answer for Electrical Packaging Problem

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

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