2018
DOI: 10.1109/access.2018.2873081
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RBER Aware Multi-Sensing for Improving Read Performance of 3D MLC NAND Flash Memory

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Cited by 10 publications
(7 citation statements)
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“…BNU completes the functions of equation ( 3), (4), and (5). CNU executes equation (2) and (3). The check node message can be recovered by equation ( 3) and (4).…”
Section: B Ldpc Decoder Architecturementioning
confidence: 99%
See 1 more Smart Citation
“…BNU completes the functions of equation ( 3), (4), and (5). CNU executes equation (2) and (3). The check node message can be recovered by equation ( 3) and (4).…”
Section: B Ldpc Decoder Architecturementioning
confidence: 99%
“…NAND Flash is widely used in portable devices such as mobile phone, digital camera and tablet computer for its large storage capacity and low power consumption [1]. However, high-capacity NAND Flash memory, which employs multilevel cell (MLC) technique, suffers higher error rate and lower reliability [2]. Recently, Low-Density Parity-Check (LDPC) coding technique has gained a large attention to reduce the bit error rate of MLC based NAND Flash [3].…”
Section: Introductionmentioning
confidence: 99%
“…Ho et al [ 26 ] proposed a one-shot program design to accelerate programming speed of 3D flash memories and to reduce data error rates. Zhang et al [ 27 ] considered to improve the read performance of 3D SSDs in the view of ECC efficiency and proposed a RBER aware multi-sensing scheme to decrease the number of read thresholds.…”
Section: Background and Related Workmentioning
confidence: 99%
“…[1][2] While the transition from 2D to 3D structures has achieved a huge reduction in device size and bit cost, size scaling is still highly required for further development of 3D NAND flash memory. For instance, 3D charge-trap (CT) NAND flash memory, which usually adopts a macaroni-like vertical channel structure, has been rapidly developed because of its ultra-high storage density, low cost, well reliability, and diversity in novel applications [3][4][5][6][7][8]. The cylindrical shape of 3D CT NAND with ONO stack (SiO2/Si3N4/SiO2) from inside out is beneficial to the field distribution in the CT layer (Si3N4), which allows thicker tunneling oxide (SiO2) to enlarge the memory window.…”
Section: Introductionmentioning
confidence: 99%