Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10&lt;sup&gt;&amp;#x2212;6&lt;/sup&gt; to 10&lt;sup&gt;2&lt;/sup&gt; s&lt;sup&gt;&amp;#x2212;1&lt;/sup&gt;

Nie, Xu; Bhate, D.; Chan, D.; Chen, W.; Subbarayan, Ganesh; Dutta, I.

doi:10.1109/itherm.2008.4544333

Cited by 3 publications

(3 citation statements)

References 14 publications

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“…Therefore, for the PBGA package with ENIG finish, the common failure mode is IMC layer brittle cracking. For the PBGA package with OSP finish, due to stronger IMC adhesion strength, the failure site is being migrated to the solder joint, copper traces, and PCB resin layers [2,7,9]. Lall [22] also reported PCB resin cracks in the drop test for chip scale package.…”

Section: Board Level Drop Test and Results Analysismentioning

confidence: 99%

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Study on Board-Level Drop Impact Reliability of Sn–Ag–Cu Solder Joint by Considering Strain Rate Dependent Properties of Solder

Xing

Pang

2015

IEEE Trans. Device Mater. Relib.

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Board-level drop reliability test and analysis require dynamic characterization of the high strain-rate properties of the solder, along with solder joint failure tests. Relying on just the drop impact analysis of board-level dynamic response (i.e. G-levels and board bending strains) and an over-simplification of deformation response of solder joints (i.e. assuming elastic stress criteria) can lead to misleading conclusions in the physics-of-failure understanding in drop impact tests. In this work, impact tests were conducted with a split Hopkinson pressure bar (SHPB) test system to study the dynamic response of bulk solder materials. A finite element analysis (FEA) of drop impact was conducted by considering different solder constitutive models such as the elastic and strain ratedependent plastic model to investigate the effect of solder constitutive model on the dynamic response of the solder joint. The important finding of this study is that the constitutive model used has a major impact on the dynamic response of solder joint stress and strain results. Theoretically, it is predicted that the strain rate-dependent plastic model gave better correlation results than the simple elastic model. A solder joint reliability characterization using drop impact test with a clamped-clamped boundary condition was investigated for a plastic ball grid array (PBGA) assembly with Sn-Ag-Cu solder and 2 board surface finishes. In order to assess drop reliability of solder joint with different surface finishes, Charpy test was conducted to evaluate dynamic strength of soldered specimen using Sn-Ag-Cu solder and with or without Ni/Au plating. Index Terms-Board-level drop test, Charpy impact test, finite element modeling, Sn-Ag-Cu solder joint, strain rate-dependent model.

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Section: Board Level Drop Test and Results Analysismentioning

confidence: 99%

“…The principle of the SHPB test is based on the theory of stress wave propagation in an elastic bar and the interaction between a stress pulse and a specimen of different impedance. The stress and strain can be measured and calculated based on stress wave theory [9]. Fig.…”

Section: Materials Characterization Of Soldermentioning

confidence: 99%

Study on Board-Level Drop Impact Reliability of Sn–Ag–Cu Solder Joint by Considering Strain Rate Dependent Properties of Solder

Xing

Pang

2015

IEEE Trans. Device Mater. Relib.

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“…Osgood model by introducing testing temperature and strain rate, in an attempt to predict the stress-strain behavior for SAC387. Nie, et al[63] …”

mentioning

confidence: 99%

The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders

Mustafa

Roberts

Suhling

et al. 2013

Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; M

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Solder joints in electronic assemblies are typically subjected to thermal cycling, either in actual application or in accelerated life testing used for qualification. Mismatches in the thermal expansion coefficients of the assembly materials cause the solder joints to be subjected to cyclic (positive and negative) mechanical strains and stresses. This cyclic loading leads to thermomechanical fatigue damage that involves damage accumulation, crack initiation, crack propagation, and failure. In addition, the microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. While the effects of aging on solder constitutive behavior (stress-strain and creep) have been examined in some detail, there have been no prior studies on the effects of aging on solder failure and fatigue behavior. Aging leads to both grain and phase coarsening, and can cause recrystallization at Sn grain boundaries. Such changes are closely tied to the damage that occurs during cyclic mechanical loading. In this investigation, we have examined the effects of aging on the cyclic stress-strain behavior and fatigue life of lead free solders. Uniaxial solder test specimens (SAC105 and SAC305) have been prepared and subjected to cyclic stress/strain loading at different aging conditions. A four-parameter hyperbolic tangent empirical model has been used to fit the entire cyclic stress-strain curve and the hysteresis loop size (area) was calculated using definite integration for a given strain limit. This area represents the energy dissipated per cycle, which is correlated to the damage accumulation in the joint. Using the recorded cyclic stress-strain curves, the evolution of the solder hysteresis loops with aging have been characterized and empirically modeled. Similar to solder stress-strain and creep behavior, there is a strong effect of aging on the hysteresis loop size (and thus the rate of damage accumulation) in the solder specimens. Fatigue experiments were also performed, where the uniaxial specimens were subjected to cyclic loading over a particular strain range until failure. Fatigue failure in the experiments was defined to occur when there was a 50% peak load drop during mechanical cycling. Prior to testing, the specimens were aged (preconditioned) at 125 °C for various aging times, and then the samples were subjected to cyclic loading at room temperature (25 °C). It was found that aging decreased the mechanical fatigue life, and the effects of aging on the peak load drop have been studied. It has also been observed that degradations in the fatigue/failure behavior of the lead free solders with aging are highly accelerated for lower silver content alloys (e.g., SAC105). Various empirical failure criteria such as the Coffin-Manson model and the Morrow model have been used to fit the measured data, and the parameters in the models have been determined as a function of the aging conditions.

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Digital-image correlation and XFEM based shock-reliability models for leadfree and advanced interconnects

Lall

Kulkarni

Angral

et al. 2010

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)

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Rate-dependent behavior of Sn3.8Ag0.7Cu solder over strain rates of 10<sup>−6</sup> to 10<sup>2</sup> s<sup>−1</sup>

Cited by 3 publications

References 14 publications

Study on Board-Level Drop Impact Reliability of Sn–Ag–Cu Solder Joint by Considering Strain Rate Dependent Properties of Solder

Study on Board-Level Drop Impact Reliability of Sn–Ag–Cu Solder Joint by Considering Strain Rate Dependent Properties of Solder

The Effects of Aging of the Cyclic Stress-Strain and Fatigue Behaviors of Lead Free Solders

Digital-image correlation and XFEM based shock-reliability models for leadfree and advanced interconnects

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