Rapid Simulation of Photonic Integrated Circuits using Verilog-A Compact Models

Shawon, Jubayer; Saxena, Vishal

doi:10.1109/mwscas.2019.8885372

Cited by 4 publications

(2 citation statements)

References 12 publications

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“…Recent work has focused on integrating compact models of photonic devices into standard CMOS simulation environments e.g. using VerilogA [52], [53] or with commercial links between software providers such as Cadence and Lumerical establishing common electronic photonic design automation (EPDA) [54]. It works well for passive optics that can be described with S-parameters but becomes more challenging when modelling active components such as lasers or modulators in combination with driver electronics [55].…”

Section: Co-simulation and Design Frameworkmentioning

confidence: 99%

Towards the Integration of InP Photonics With Silicon Electronics: Design and Technology Challenges

Yao

Liu

Matters-Kammerer

et al. 2021

J. Lightwave Technol.

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Intimate integration of photonics with electronics is regarded as the key to further improvement in bandwidth, speed and energy efficiency of information transport systems. Here, a method based on wafer-scale polymer bonding is reviewed which is compatible with foundry-sourced high-performance InP photonics and BiCMOS electronics. We address challenges with respect to circuit architecture, co-simulation framework and interconnect technology and introduce our approach that can lead to broadband high-density interconnects between photonics and electronics. Recent proof-of-concept work utilizing DC-coupled driver connections to modulators, which significantly reduces the interconnect complexity, is summarized. Furthermore, cosimulation concepts based on equivalent circuit models are discussed with emphasis on the importance of impedance matching between driver and modulator. Finally, realizations of broadband interconnects and functional photonic building blocks after wafer bonding are highlighted to demonstrate the potential of this wafer-scale co-integration method.

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Section: Co-simulation and Design Frameworkmentioning

confidence: 99%

Towards the Integration of InP Photonics With Silicon Electronics: Design and Technology Challenges

Yao

Liu

Matters-Kammerer

et al. 2021

J. Lightwave Technol.

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“…Several articles have previously demonstrated Verilog-A macro-modeling of photonic and electronic components, as evidenced in references [10]- [12]. These works have predominantly focused on macro-modeling waveguides, lasers, Mach-Zehnder modulators, photodiodes, and even optomechanical systems, as exemplified in reference [13].…”

Section: Introductionmentioning

confidence: 99%

Verilog-A Modeling of an Electrophotonic Emitter-Waveguide-Detector (EWD) System Compatible with Standard CMOS Technology

Orozco Coy,

Gonzalez-Diaz,

Aceves-Mijares

et al. 2024

IEEE Latin Am. Trans.

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Lab-On-A-Chip (LOC) devices that utilize lightbased detection principles offer advantages compared with their electronic counterparts, such as higher sensitivity and not necessarily needing markers, simplifying their use, and reducing reagent consumption. Recently, the development of Si-based light emitters compatible with standard CMOS manufacturing processes has overcome one of the main obstacles in creating fully integrated electrophotonic systems on the same substrate. This groundbreaking achievement means the possibility of integrating photonic and driving circuitry in the same chip. However, due to its extreme novelty and specific electronic requirements, new design solutions must be tailored to further aid fulfilling the promise of a fully integrated electrophotonic system. The lack of existing circuit design models and tools hinders the advancement of this technology. To aid further in designing these systems, this article presents the development of a Verilog-A macromodel for an electrophotonic circuit composed of a Light Emitting Capacitor (LEC), a waveguide, and a sensor. The system was simulated in the Cadence Virtuoso environment, and a use case exhibits the system simulation including a CMOS circuit for emitter excitation and sensor reading.

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Compact Modeling and Photoelectric Co-simulation of Hybrid BICMOS-Photonic Segmented-Electrode MZM Transmitter

Ren¹,

Xing²,

Huang³

et al. 2020

2020 IEEE 5th International Conference on Integrated Circuits and Microsystems (ICICM)

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Rapid Simulation of Photonic Integrated Circuits using Verilog-A Compact Models

Cited by 4 publications

References 12 publications

Towards the Integration of InP Photonics With Silicon Electronics: Design and Technology Challenges

Towards the Integration of InP Photonics With Silicon Electronics: Design and Technology Challenges

Verilog-A Modeling of an Electrophotonic Emitter-Waveguide-Detector (EWD) System Compatible with Standard CMOS Technology

Compact Modeling and Photoelectric Co-simulation of Hybrid BICMOS-Photonic Segmented-Electrode MZM Transmitter

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