Rapid prototyping using high density interconnects

Abstract

This paper introduces the H@DES (DIODES) system for the rapid prototyping of DSP electronic systems. DIODES merges silicon compiler and high-density interconnect technology with the goal of prototyping hardware systems as quickly as possiblewithin one day. Working from a high-level algorithmic description of a DSP algorithm, DIODES will determine which chips from an inventory of specially designed chips are needed to implement the design. These chips are then placed on a prepared substrate and routed together using computer controlled laser lithography to produce a hardware implementation of the design. -IAcquisition System with On-chip Digital Signal Processing.