Rapid power cycling of flip-chip and CSP components on ceramic substrates

Lenkkeri, Jaakko; Jaakola, Tuomo

doi:10.1016/s0026-2714(01)00006-3

Cited by 9 publications

(3 citation statements)

References 4 publications

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“…Generally the power-cycling tests are required power (heating) chip and a precise control technique [8][9]. It is exhausting work, so almost researchers do the chambercycling test.…”

Section: Pseudo-power Cycling Machinementioning

confidence: 99%

Fatigue Life Evaluation of Lead-free Solder under Thermal and Mechanical Loads

Kim

Lee

2007

2007 Proceedings 57th Electronic Components and Technology Conference

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In this study, two types of fatigue tests were conducted. First, cyclic bending tests were performed using the microbending tester. A four-point bending test method was adopted, because it induces uniform stress fields within a loading span. Second, thermal fatigue tests were conducted using a pseudo power cycling machine which was newly developed for a realistic testing condition. The pseudo-power cycling method makes up for the weak points in a power cycling and a chamber cycling method. Two compositions of solder are tested in all test condition, one is lead-free solder (95.5Sn4.OAgO.5Cu) and the other is eutectic lead-contained solder (63Sn37Pb).In the cyclic bending test, the solder that exhibits a good reliability can be reversed depending on the load conditions. The lead-contained solders have a longer fatigue life in the region where the applied load is high. On the contrary, the lead-free solder sustained more cyclic loads in the small load region. A similar trend was detected at the thermal cycling test. Furthermore, to certify the crack behavior, the failed specimen was sectioned. In thermal cycling case, crack initiated inner solder joints. But outmost solder failed first in the cyclic bending test.A three-dimensional finite element analysis model was constructed. A finite element analysis using ABAQUS was performed to extract the applied stress and strain in the solder joints. A constitutive model which includes both creep and plasticity was employed. Thermal fatigue was occurred due to the creep. And plastic deformation is main damage for bending failure. From the inelastic energy dissipation per cycle versus fatigue life curve, it can be found that the bending fatigue life is longer than the thermal fatigue life.

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“…Generally the power-cycling tests are required power (heating) chip and a precise control technique [8][9]. It is exhausting work, so almost researchers do the chambercycling test.…”

Section: Pseudo-power Cycling Machinementioning

confidence: 99%

Fatigue Life Evaluation of Lead-free Solder under Thermal and Mechanical Loads

Kim

Lee

2007

2007 Proceedings 57th Electronic Components and Technology Conference

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“…For highly reliable packages in which excellent thermal stability and impermeability are essential, ceramic-based packages are preferred over plastics [6][7][8]. The demand for ceramic packages has increased a lot recently for the high performance hermetically sealed devices such as MEMS, sensors, microwave devices, and imaging devices [9,10]. Alumina (Al 2 O 3 ) and aluminum nitride (AlN)-based ceramics are used in many special applications where density, high hardness, chemical inertness, low thermal conductivity and good high temperature properties are required [11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Customized glass sealant for ceramic substrates for high temperature electronic application

Sharif

Gan

Chen

2014

Microelectronics Reliability

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“…As such, the equipment for testing can be more straightforward than for thermal cycling. Furthermore, an additional advantage of power cycling is the reduced time taken to complete a cycle, which may be as short as one minute [7].…”

Section: Introductionmentioning

confidence: 99%

Modeling of the Power Cycling Performance of a Si on Si Flip Chip Assembly

Ochana

Hutt

Whalley

et al.

Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006.

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Flip Chip (FC) technology offers many advantages over conventional surface mount technology, including a smaller device footprint and higher interconnection density. Low power but complex consumer items, such as mobile telecommunications devices, utilise this packaging technology and it is likely to spread to other electronics sectors where components have higher power dissipations and/or they have to operate in a hostile environment.As the scope for FC packaging broadens, a reliable means of establishing the long term performance of a particular package is necessary. Traditionally thermal cycling has been a primary reliability test for electronic assemblies including FC, however this fails to capture the behaviour of assemblies where the component thermal expansion is well matched to that of the substrate due to the isothermal heating and cooling of the assembly. In this situation power cycling offers an alternative means of determining the module performance. This paper describes the use of Finite Element Modeling (FEM) to explore the effects of power cycling on a silicon on silicon Multi-Chip Module (MCM) constructed with a low solder joint standoff height of 30-35µm. Particular attention was given to the boundary conditions that are inevitably atypical of those used in traditional thermal cycling. The paper presents results of the temperature distributions throughout the assembly, which were found to depend upon the substrate base material (FR4 or copper) that the MCM was attached to. The results of the FEM analysis were verified by assembling test devices and measuring their temperature distribution under steady state and power cycling conditions. The predicted temperatures may then be used as boundary conditions in FEM of thermal stresses and fatigue in the assembly.

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Rapid power cycling of flip-chip and CSP components on ceramic substrates

Cited by 9 publications

References 4 publications

Fatigue Life Evaluation of Lead-free Solder under Thermal and Mechanical Loads

Fatigue Life Evaluation of Lead-free Solder under Thermal and Mechanical Loads

Customized glass sealant for ceramic substrates for high temperature electronic application

Modeling of the Power Cycling Performance of a Si on Si Flip Chip Assembly

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