Customized glass sealant for ceramic substrates for high temperature electronic application

Sharif, Ahmed; Gan, Chee Lip; Chen, Zhong

doi:10.1016/j.microrel.2014.07.005

Cited by 17 publications

(4 citation statements)

References 19 publications

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“…Gf is nowadays also adopted to seal other ceramic materials, see, e.g., [ 22 , 23 ], and, in its lead-free version or in a mix with other materials such as graphene, for solar cells [ 24 ]; however, here we focus on its traditional application in the microsystem industry [ 20 , 25 ], and we aim to carefully characterize the material as obtained from the foundry, so that the subsequent calculations regarding wafer warpage can be more accurate.…”

Section: Introductionmentioning

confidence: 99%

An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding

et al. 2023

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A thermo-mechanical wafer-to-wafer bonding process is studied through experiments on the glass frit material and thermo-mechanical numerical simulations to evaluate the effect of the residual stresses on the wafer warpage. To experimentally characterize the material, confocal laser profilometry and scanning electron microscopy for surface observation, energy dispersive X-ray spectroscopy for microstructural investigation, and nanoindentation and die shear tests for the evaluation of mechanical properties are used. An average effective Young’s modulus of 86.5 ± 9.5 GPa, a Poisson’s ratio of 0.19 ± 0.02, and a hardness of 5.26 ± 0.8 GPa were measured through nanoindentation for the glass frit material. The lowest nominal shear strength ranged 1.13 ÷ 1.58 MPa in the strain rate interval to 0.33 ÷ 4.99 × 10−3 s−1. To validate the thermo-mechanical model, numerical results are compared with experimental measurements of the out-of-plane displacements at the wafer surface (i.e., warpage), showing acceptable agreement.

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Section: Introductionmentioning

confidence: 99%

An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding

et al. 2023

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“…These fibers hardly withstand a high temperature, resulting in the failure of the electronics on their surfaces. Inorganic materials, such as ceramics, 31 silicon, 32 and silicon carbide 33 are commonly used to fabricate high-temperature-resistant electronics. However, these sensors are usually rigid and not compatible with textiles.…”

Section: Introductionmentioning

confidence: 99%

A carbon nanotube-based textile pressure sensor with high-temperature resistance

et al. 2022

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“…1,2) These techniques have been intensively researched in the packaging systems such as display, dye sensitized solar cells, organic light-emitting diodes, solid oxide fuel cells, etc. [3][4][5] If it is not completely sealed, it may cause a decrease in the durability of internal materials or components in the device. Recently, research has been conducted to apply laser sealing using a glass fiber sealant as an advanced method.…”

Section: Introductionmentioning

confidence: 99%

Development of Sealing Technology for Far-Infrared Multispectral ZnS Using Chalcogenide Glass Material

Kim¹,

In²,

Han³

et al. 2022

Korean. J. Mater. Res.

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Various types of optical materials and devices used in special environments must satisfy durability and optical properties. In order to improve the durability of zinc sulfide multispectral (MS ZnS) substrates with transmission wavelengths from visible to infrared, Ge-Sb-Se-based chalcogenide glass was used as a sealing material to bond the MS ZnS substrates.Wetting tests of the Ge-Sb-Se-based chalcogenide glass were conducted to analyze flowability as a function of temperature, by considering the glass transition temperature (T g ) and softening temperature (T s ). In the wetting test, the viscous flow of the chalcogenide glass sample was analyzed according to the temperature. After placing the chalcogenide glass disk between MS ZnS substrates (20 × 30 mm), the sealing test was performed at a temperature of 485 °C for 60 min. Notably, it was found that the Ge-Sb-Se-based chalcogenide glass sealed the MS ZnS substrates well. After the MS ZnS substrates were sealed with chalcogenide glass, they showed a transmission of 55 % over 3~12 µm. The tensile strength of the sealed MS ZnS substrates with Ge-Sb-Se-based chalcogenide glass was analyzed by applying a maximum load of about 240 N, confirming its suitability as a sealing material in the far infrared range.

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Customized glass sealant for ceramic substrates for high temperature electronic application

Cited by 17 publications

References 19 publications

An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding

An Experimental and Numerical Study on Glass Frit Wafer-to-Wafer Bonding

A carbon nanotube-based textile pressure sensor with high-temperature resistance

Development of Sealing Technology for Far-Infrared Multispectral ZnS Using Chalcogenide Glass Material

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