2013
DOI: 10.1007/s00339-013-8155-8
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Rapid micromachining of high aspect ratio holes in fused silica glass by high repetition rate picosecond laser

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Cited by 60 publications
(23 citation statements)
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“…The laser beam can be focused through the bulk sample onto the rear surface and hence the beam energy can be transferred to the rear surface [19][20][21]. Microchannel forming in glass using a focused femtosecond laser beam and selective chemical etching has been reported [10,22]. In contrast, deep drilling from the front surface has had less attention as such drilling is difficult to achieve.…”
Section: Introductionmentioning
confidence: 97%
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“…The laser beam can be focused through the bulk sample onto the rear surface and hence the beam energy can be transferred to the rear surface [19][20][21]. Microchannel forming in glass using a focused femtosecond laser beam and selective chemical etching has been reported [10,22]. In contrast, deep drilling from the front surface has had less attention as such drilling is difficult to achieve.…”
Section: Introductionmentioning
confidence: 97%
“…Weber et al [8] studied the geometry of the laser heat source and temperature fields comparing three-dimensional and one-dimensional heat flows using the results obtained from microhole drilling of stainless steel and the cutting of anisotropic materials, e.g., carbon fiber-reinforced plastics (CFRP). Many studies on heat accumulation in glass have been reported [9][10][11][12][13]; the transparency of glass enables inside focusing and modification induced by ultrafast laser illumination. The modification can be applied for machining after etching [10], waveguide formation [11], and welding [12,13].…”
Section: Introductionmentioning
confidence: 99%
“…While 1-2 nanosecond and picosecond high repetition rate laser micromachining has been proven a very useful tool because of the limited thermally affected zone and debris near the ablated area [14][15][16], there is only a limited number of reports on the picosecond high repetition rate PLD of oxides.…”
Section: Introductionmentioning
confidence: 99%
“…Mechanism and technics of material removing and ablation for micro and nano-processing, especially microdrilling and structuring applications, using ultra-short pulses laser irradiation have been intensively studied in recent years [3][4][5][6][7] . One of the most efficient and accurate drilling technology namely helical drilling was reported a few years ago [8] .…”
Section: Introductionmentioning
confidence: 99%