Rapid and Controllable Sintering of Gold Nanoparticle Inks at Room Temperature Using a Chemical Agent

Abstract

We show that oxidation of protective thiol ligands and the exothermic reduction of surface area are important factors in the sintering of thiol-stabilized gold nanoparticle films. We also present a chemical treatment to achieve sintering of gold nanoparticles at room temperature. The process is facilitated by the remarkable enthalpy of reaction arising from the reduction of the surface area of the nanoparticles.

Simulation and prediction of the thermal sintering behavior for a silver nanoparticle ink based on experimental input

“…31 Also removal of thiol stabilizers from a gold NP-based ink by oxidation via nitrogen dioxide was reported. 32 Aer chemical removal of the stabilizers, coalescence of the naked particles and rising electrical conductivity was observed. Another chemical sintering approach is the addition of electrolytes (halides, polyelectrolytes) to printed silver NP-based inks in order to replace the stabilizing molecules on the surface of each particle and to reduce the steric repulsion that causes spontaneous coalescence of NPs.…”

Green nanomaterials for psoriatic lesions

“…80.76 %. TGA and DSC analysis of nanomaterials based on metallic nanoparticles are very commonly studied with respect to sintering nanoparticle inks for printed electronics [96][97][98][99][100]. Yu et al [99] presented TGA results and DSC profiles of AgNPs-organic molecules (in their case, the silver nanoparticles were obtained using sodium polyacrylate and ascorbic acid) with sizes of 20-30, 30-40 and 100-120 nm.…”

Gold-nanoparticle Inks for Room-temperature Formation of Conductive Films

“…The dipped Ag nanoparticle films showed resistivity as low as 7.3 © 10 ¹5 ³ cm. Similarly, Coutts et al 16 coalesced thiolprotected Au nanocrystals by dipping them into oxidizing agents at room temperature. These immersion treatments are effective in terms of avoiding heat and light, but they cannot be applied to solution-labile materials.…”