Randomly shaped 3D electronics using innovative combination of standard surface mount technologies and polymer processing

Tenchine, Lionel; Dassonville, O.

doi:10.1109/icmid.2016.7738937

Cited by 4 publications

(1 citation statement)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…After cooling down, the component, which retains its final shape, is removed from the mold, and trimmed. The temperature range of this process depends on the substrate used but typically ranges between 120 and 200 • C. Due to its ease of use, thermoforming, along with other additive manufacturing methods, is gaining traction in producing free-form electronic component prototypes for control components in automotive and medical industries [4][5][6], antennas [7][8][9][10][11][12][13], sensors [14][15][16][17], diodes [18,19], solar cells [20], LED array [21] and epidermal electronics products [22][23][24][25].…”

Section: Introductionmentioning

confidence: 99%

Thermoformable Conductive Compositions for Printed Electronics

Shahabadi,

Tan,

Magdassi

2023

Coatings

View full text Add to dashboard Cite

The development of three-dimensional printed electronics has garnered significant interest due to the ease of integration of electronic circuitry on 3D surfaces. However, it is still very challenging to achieve the desired conformability, stretchability, and adhesion of conductive pastes used for printing on thermoformable substrates. In this study, we propose the use of novel thermoformable ink composed of copper flakes coated with silver, which enables us to prevent the oxidation of copper, instead of the commonly used silver inks. Various polymer/solvent/flake systems were investigated, resulting in thermoformable conductive printing compositions that can be sintered under air. The best inks were screen printed on PC substrates and were thermoformed using molds with different degrees of strain. The effects of the various components on the thermoforming ability and the electrical properties and morphology of the resulting 3D structures were studied. The best inks resulted in a low sheet resistivity, 100 mΩ/□/mil and 500 mΩ/□/mil before and after thermoforming at 20%, respectively. The feasibility of using the best ink was demonstrated for the fabrication of a thermoformable 3D RFID antenna on PC substrates.

show abstract