Evaluation of Mechanical Stress on Electronic Assemblies During Thermoforming and Injection Molding for Conformable Electronics

Schirmer, Julian; Reichenberger, Marcus; Wimmer, Annette; Reichel, Herbert; Neermann, Simone; Franke, Jörg

doi:10.1109/mid50463.2021.9361624

Cited by 6 publications

(6 citation statements)

References 14 publications

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“…However, there were limited resources available to investigate the electronics behavior before and after the in-molding process. As a result, several researchers expressed interest in realizing the IME concept, by examining the impact of IME on different electronic packages, flexible foil materials, metallization, assembly methods, and mold shape to determine the effect of plastic materials on microsystems [84][85][86][87][88]. A summary is presented in table 8.…”

Section: In-mold Applications and Trendsmentioning

confidence: 99%

The integration of electronic circuits in plastics using injection technologies: a literature review

Bakr¹,

Bossuyt²,

Vanfleteren³

2022

Flex. Print. Electron.

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A great deal of attention has been paid in recent years to the integration of two and three-dimensional integrated electronic parts into plastics, both for their potential applications in modern human lives and for their outstanding properties, which include the ability to reduce product weight and space while increasing product reliability. The development of integrated electronic devices into plastics is advancing rapidly, owing to advancements in methodology and manufacturing techniques, which have significantly raised researcher interest in this topic. In-mold electronics (IME) is a term that describes an injection molding technology that integrates a printed foil with electrical components into a plastic part during the molding process. It is a revolutionary way to form two and three-dimensional products using electronic printed circuits. IME technology is comprised of three fundamental disciplines of study: electronics, materials science, and plastic manufacturing processes. Therefore, this review article aims to summarize the knowledge of these three primary fields to present an overview of in-mold technology. This article covers background history, a description of the In-mold process flow, and summarizes the recent real-life applications. Additionally, this article discusses some of the present technology challenges that must be overcome.

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Section: In-mold Applications and Trendsmentioning

confidence: 99%

The integration of electronic circuits in plastics using injection technologies: a literature review

Bakr¹,

Bossuyt²,

Vanfleteren³

2022

Flex. Print. Electron.

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show abstract

“…Next efforts made researchers interested in improving the technology by presenting various functionalities in the plastic products. An overview is shown in table 2 Moreover, a wide variety of promising approaches to realize the concept of such electronic structures including material combination, adhesion, and overall electronic performance were discussed in the following studies [9,[11][12][13].…”

Section: Flexible Hybrid Electronics (Fhe)mentioning

confidence: 99%

Over-molding of two-dimensional curved shape using polyimide copper cladding foil

Bakr

Rezaei

et al. 2021

2021 23rd European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC)

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“…However, the prevailing thermal and mechanical loads during the injection molding cycle necessary to shape the molten polymer can lead to failures within the electrical circuits [3][4][5]. The mechanical forces may be considered separately as shear loads acting in-plane and pressure loads acting normally upon the component surfaces.…”

Section: Introductionmentioning

confidence: 99%

“…Schirmer et al [4,8] overmolded assembled foils with components of sizes 0402, 0603, and 0805 with polycarbonate (PC). Larger components showed lower failure rates than smaller components when the conductive adhesive was used.…”

Section: Introductionmentioning

confidence: 99%

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Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation

et al. 2023

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The integration of assembled foils in injection-molded parts is a challenging step. Such assembled foils typically comprise a plastic foil on which a circuit board is printed and electronic components are mounted. Those components can detach during overmolding when high pressures and shear stresses prevail due to the injected viscous thermoplastic melt. Hence, the molding settings significantly impact such parts’ successful, damage-free manufacturing. In this paper, a virtual parameter study was performed using injection molding software in which 1206-sized components were overmolded in a plate mold using polycarbonate (PC). In addition, experimental injection molding tests of that design and shear and peel tests were made. The simulated forces increased with decreasing mold thickness and melt temperature and increasing injection speed. The calculated tangential forces in the initial stage of overmolding ranged from 1.3 N to 7.3 N, depending on the setting used. However, the experimental at room temperature-obtained shear forces at break were at least 22 N. Yet, detached components were present in most of the experimentally overmolded foils. Hence, the shear tests performed at room temperature can only provide limited information. In addition, there might be a peel-like load case during overmolding where the flexible foil might bend during overmolding.

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Evaluation of Mechanical Stress on Electronic Assemblies During Thermoforming and Injection Molding for Conformable Electronics

Cited by 6 publications

References 14 publications

The integration of electronic circuits in plastics using injection technologies: a literature review

The integration of electronic circuits in plastics using injection technologies: a literature review

Over-molding of two-dimensional curved shape using polyimide copper cladding foil

Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation

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