2021 23rd European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC) 2021
DOI: 10.23919/empc53418.2021.9584946
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Over-molding of two-dimensional curved shape using polyimide copper cladding foil

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“…However, there were limited resources available to investigate the electronics behavior before and after the in-molding process. As a result, several researchers expressed interest in realizing the IME concept, by examining the impact of IME on different electronic packages, flexible foil materials, metallization, assembly methods, and mold shape to determine the effect of plastic materials on microsystems [84][85][86][87][88]. A summary is presented in table 8.…”
Section: In-mold Applications and Trendsmentioning
confidence: 99%
“…However, there were limited resources available to investigate the electronics behavior before and after the in-molding process. As a result, several researchers expressed interest in realizing the IME concept, by examining the impact of IME on different electronic packages, flexible foil materials, metallization, assembly methods, and mold shape to determine the effect of plastic materials on microsystems [84][85][86][87][88]. A summary is presented in table 8.…”
Section: In-mold Applications and Trendsmentioning
confidence: 99%