Crystalline InAs films have been prepared directly at room temperature through a new electrochemically induced alloying method by controllably reducing As 2 O 3 dissolved in an alkaline aqueous solution at an indium (In) foil electrode. Steady-state Raman spectra, transmission electron microscopy, and selected area electron diffraction indicated that the as-prepared films crystallize in the zincblende phase with no further thermal treatments. Cyclic voltammetry measurements, optical images, and steady-state Raman spectra confirmed that a clean oxide-free interface is critical for the successful formation of the binary InAs phase. The salient feature of this work is the use of simple aqueous electrochemistry to simultaneously remove passive metal oxides from the In(s) metal surface while controllably reducing dissolved arsenic oxide at the interface to drive the In−As alloying reaction. Raman spectral mapping data illustrate that the resulting film coverage and homogeneity are a strong function of the formal As 2 O 3 concentration and the duration of the electrodeposition experiment. Potential-dependent in situ Raman spectroscopy was used to implicate the solid-state reaction as the rate-limiting step in InAs film formation over the first 160 min, after which solid-state diffusion dominated the kinetics. The collective results establish a precedent for an alternative synthetic strategy for crystalline InAs thin films that does not require vacuum or sophisticated furnaces, toxic gaseous precursors like arsine, or exotic solvents.
■ INTRODUCTIONLarge-scale production of crystalline thin films of III−V semiconductors is challenging in two ways. First, the majority of synthetic methods are energy-and resource-intensive. 1−3 For example, vapor-phase crystal growth techniques such as metal− organic vapor phase epitaxy (MOVPE) and molecular beam epitaxy (MBE) involve ultrahigh vacuum (UHV) equipment and temperatures above 400°C. 1,3 Similarly, liquid-phase epitaxy requires sustained temperatures in excess of 750°C and pressurized furnaces. 2 Second, these same fabrication methods can be difficult to incorporate directly into device fabrication processes. For example, the high temperatures and corrosive reagents used in liquid phase epitaxy (LPE), MOCVD, and MBE can damage delicate electronic device architectures [e.g., complementary metal-oxide-semiconductor (CMOS)] and sensitive platforms (e.g., plastics). As a result, cumbersome and costly transfer and integration steps are necessary. 4 An ongoing frontier in materials science is thus the discovery and development of synthetic strategies for III−V semiconductors that mitigate these aforementioned challenges while not sacrificing crystalline quality, material purity, process controllability, and reproducibility. In this vein, gas-phase 5,6 and solution-phase 7 conversions of metals into compound semiconductors have been studied as possible synthetic alternatives. 5−7 These methods offer the potential for fewer fabrication steps and potentially simpler device integration...