Radio frequency sputtering process of a polytetrafluoroethylene target and characterization of fluorocarbon polymer films

Maréchal, N.; Pauleau, Y.

doi:10.1116/1.578174

Cited by 35 publications

(7 citation statements)

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“…[2][3][4][5] Previous studies showed that a surface modification of PTFE by plasma treatment in vacuum could lead to an increase in the water contact angle (WCA) and a roughening of the samples. [6,7] This roughness can be associated to the etching [8][9][10][11] of the PTFE surface with, in certain cases, the possible incorporation of oxygen-containing polar groups into the surface. [12] At low pressure (approx.…”

Section: Introductionmentioning

confidence: 99%

PTFE Surface Etching in the Post‐discharge of a Scanning RF Plasma Torch: Evidence of Ejected Fluorinated Species

Dufour

Hubert

Viville

et al. 2012

Plasma Processes & Polymers

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The texturization of poly(tetrafluoroethylene) (PTFE) surfaces is achieved at atmospheric pressure by using the postdischarge of a radio-frequency plasma torch supplied in helium and oxygen gases. The surface properties are characterized by contact angle measurement, X-ray photoelectron spectroscopy and atomic force microscopy. We show that the plasma treatment increases the surface hydrophobicity (with water contact angles increasing from 115 to 155°) only by modifying the PTFE surface morphology and not the stoichiometry. Measurements of sample mass losses correlated to the ejection of CF2 fragments from the PTFE surface evidenced an etching mechanism at atmospheric pressure.

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Section: Introductionmentioning

confidence: 99%

PTFE Surface Etching in the Post‐discharge of a Scanning RF Plasma Torch: Evidence of Ejected Fluorinated Species

Dufour

Hubert

Viville

et al. 2012

Plasma Processes & Polymers

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“…After being first reported in the 1970s, the plasma sputter-deposited fluoropolymers have been shown to be useful as the dielectric films, water-repellent coatings, low friction coatings, and even optical coatings. − The sputtering processes have been carried out both in the magnetron sputtering systems − and in tubular-type plasma reactors, , using different working gases, including Ar, N 2 , He, and Ne. The addition of fluorocarbon gases, such as CF 4 13 and C 3 F 8 , to Ar for glow discharging has also been carried out to enhance the deposition rate and to improve the fluorine content in the deposited films. An Argon ion beam has also been used for the sputtering deposition of fluoropolymer films .…”

Section: Introductionmentioning

confidence: 99%

“…Characterization of the deposited fluoropolymer films by multiple techniques is thus of great importance. A number of characterization techniques, such as Fourier transform infrared (FTIR) spectroscopy, − , X-ray photoelectron spectroscopy (XPS), − and Rutherford backscattering spectroscopy (RBS), have been employed for the surface analysis of the sputter-deposited fluoropolymers. Characterization of the deposited fluoropolymer films with molecular-specific techniques is essential to the elucidation of the chemical structures of the deposited films, as well as to the understanding of the nature of the sputtering process.…”

Section: Introductionmentioning

confidence: 99%

Deposition of Fluoropolymer Films on Si(100) Surfaces by Rf Magnetron Sputtering of Poly(tetrafluoroethylene)

Zhang¹,

Yang²,

Kang³

et al. 2002

Langmuir

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Dielectric polymer films of about 40-300 nm in thickness were deposited on Si(100) substrates via rf plasma sputtering of a poly(tetrafluoroethylene) (PTFE) target using different sputtering gases, including Ar, CF4, N2, and H2. Oxygen plasma failed to give rise to any significant deposition. X-ray photoelectron spectroscopy (XPS), time-of-flight secondary ion mass spectrometry (ToF-SIMS), water contact angle measurement, and Fourier transform infrared (FTIR) spectroscopy results indicated that the chemical composition and molecular structure of the sputter-deposited polymer films depended strongly on the type of the sputtering gas used. The Ar, CF4, and N2 plasmas gave rise to PTFE-like films with a high fluorine content, although N-containing moieties were also found in the N2 plasma-deposited films. The H2 plasma, on the other hand, resulted only in the deposition of a polyethylene-like film. The deposition rate and the dielectric constant (κ) of the resulting fluoropolymer films were also found to be dependent on the type of the sputtering gas. The fluoropolymer film deposited from sputtering by CF4 plasma had a κ value of 1.9, which was lower than that of the pristine PTFE film (κ ) 2.0-2.1). On the other hand, the nonreactive Ar plasma gave rise to the highest deposition rate among the five sputtering gases. Peel adhesion test results suggested that all the sputter-deposited films adhered strongly to the Si(100) surfaces.

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“…The great advantage of RF magnetron sputtering over commonly used plasma-enhanced chemical vapor deposition is the complete lack of gaseous or liquid precursors, which makes RF sputtering a “green” technology. Although much attention has been devoted to the fabrication and characterization of fluorocarbon plasma polymers [10,11,12,39,40,41,42,43,44,45,46,47], other polymers were also studied, including polyarylates [48], polyimides [45,49,50,51,52], polyethylene [50,53,54], polyetherimide [55], polypropylene [56,57], and Nylon [58].…”

Section: Introductionmentioning

confidence: 99%

Magnetron Sputtering of Polymeric Targets: From Thin Films to Heterogeneous Metal/Plasma Polymer Nanoparticles

et al. 2019

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Magnetron sputtering is a well-known technique that is commonly used for the deposition of thin compact films. However, as was shown in the 1990s, when sputtering is performed at pressures high enough to trigger volume nucleation/condensation of the supersaturated vapor generated by the magnetron, various kinds of nanoparticles may also be produced. This finding gave rise to the rapid development of magnetron-based gas aggregation sources. Such systems were successfully used for the production of single material nanoparticles from metals, metal oxides, and plasma polymers. In addition, the growing interest in multi-component heterogeneous nanoparticles has led to the design of novel systems for the gas-phase synthesis of such nanomaterials, including metal/plasma polymer nanoparticles. In this featured article, we briefly summarized the principles of the basis of gas-phase nanoparticles production and highlighted recent progress made in the field of the fabrication of multi-component nanoparticles. We then introduced a gas aggregation source of plasma polymer nanoparticles that utilized radio frequency magnetron sputtering of a polymeric target with an emphasis on the key features of this kind of source. Finally, we presented and discussed three strategies suitable for the generation of metal/plasma polymer multi-core@shell or core-satellite nanoparticles: the use of composite targets, a multi-magnetron approach, and in-flight coating of plasma polymer nanoparticles by metal.

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Radio frequency sputtering process of a polytetrafluoroethylene target and characterization of fluorocarbon polymer films

Cited by 35 publications

References 0 publications

PTFE Surface Etching in the Post‐discharge of a Scanning RF Plasma Torch: Evidence of Ejected Fluorinated Species

PTFE Surface Etching in the Post‐discharge of a Scanning RF Plasma Torch: Evidence of Ejected Fluorinated Species

Deposition of Fluoropolymer Films on Si(100) Surfaces by Rf Magnetron Sputtering of Poly(tetrafluoroethylene)

Magnetron Sputtering of Polymeric Targets: From Thin Films to Heterogeneous Metal/Plasma Polymer Nanoparticles

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