Radiation Stable, Low Viscosity Impregnating Resin Systems for Cryogenic Applications

Evans, D.; Canfer, Simon

doi:10.1007/978-1-4615-4293-3_46

Cited by 18 publications

(5 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Epoxy resins are used in a wide range of applications such as adhesives, coatings, electrical laminates, encapsulation of semiconductor devices, matrix material for composites, structural components [1,2,3,4,5,6,7,8,9,10,11,12], flame retardants [13,14] and cryogenic engineering [15,16,17] because of their superior mechanical properties, adhesion and chemical resistance. Epoxy resins are also highly versatile because of the variety of curing agents or hardeners available [4,18,19].…”

Section: Epoxy Network Isothermal Cure Thermal Cure Kineticsmentioning

confidence: 99%

Curing of off-stoichiometric amine–epoxy thermosets

Morancho¹,

Ramis²,

Fernández‐Francos³

et al. 2018

J Therm Anal Calorim

View full text Add to dashboard Cite

The kinetics of the epoxy-amine polycondensation and the epoxy homopolymerization in off-stoichiometric epoxy/amine formulations with excess of epoxy groups, and in the presence of an anionic initiator have been investigated. Diglycidyl ether of bisphenol A (DGEBA) and diethylenetriamine (DETA) have been used as epoxy and amine reagents, respectively, and 2-methylimidazole (2MI) has been used as anionic initiator. This study has been carried out using a differential scanning calorimeter (DSC). The thermal-mechanical properties of the partially cured and fully cured materials with and without initiator have been determined by DSC and dynamic-mechanical analysis.

show abstract

Section: Epoxy Network Isothermal Cure Thermal Cure Kineticsmentioning

confidence: 99%

Curing of off-stoichiometric amine–epoxy thermosets

Morancho¹,

Ramis²,

Fernández‐Francos³

et al. 2018

J Therm Anal Calorim

View full text Add to dashboard Cite

show abstract

“…With the rapid developments of spacecraft and superconducting cable technologies, and large cryogenic engineering projects such as International Thermonuclear Experimental Reactor (ITER), etc., epoxy resins have been increasingly employed in cryogenic engineering applications as impregnating materials, adhesives or matrices for advanced composites [5][6][7]. In cryogenic engineering, liquid nitrogen and liquid helium are generally employed as cooling media and liquid nitrogen is more often used due to its low cost.…”

Section: Introductionmentioning

confidence: 99%

Simultaneously increasing cryogenic strength, ductility and impact resistance of epoxy resins modified by n-butyl glycidyl ether

Chen

Guo

Yang

et al. 2009

Polymer

121

View full text Add to dashboard Cite

“…Epoxy resins are widely used in cryogenic engineering as insulating material, structural adhesive, and matrix due to their low cost, ease of processing, excellent specific strength and thermal and electrical insulation properties at cryogenic temperatures [1][2][3][4]. However, highly cross-linked epoxy resins are brittle in nature and show a large coefficient of thermal expansion, which limit their applications.…”

Section: Introductionmentioning

confidence: 99%

Cryogenic properties of hollow glass microsphere/epoxy composites

Wu¹,

Huang²,

Chu³

et al. 2012

AIP Conference Proceedings

View full text Add to dashboard Cite

In this work, hollow glass microsphere (HGM) reinforced triglycidyl-p-aminophenol (TGPAP) epoxy composites was prepared and the influence of HGM on mechanical and thermal properties of the composites was investigated. Mechanical behaviors of the composites with various weight fractions of HGM from 0 to 9% were investigated in terms of impact property at both room temperature (RT) and liquid nitrogen temperature (77 K). The fracture surfaces of undoped epoxy and the composites were examined by scanning electron microscopy (SEM). The results show that both the impact strength at room temperature and 77 K are all enhanced by the addition of HGM with appropriate contents. Furthermore, the thermal conductivity and coefficients of thermal expansion of undoped epoxy and HGM/epoxy composites were also investigated from 77 K to room temperature. It is found that the composites show lower thermal conductivity and coefficient of thermal expansion than undoped epoxy. The results indicate that HGM/epoxy composites are promising cryogenic materials.

show abstract

Radiation Stable, Low Viscosity Impregnating Resin Systems for Cryogenic Applications

Cited by 18 publications

References 2 publications

Curing of off-stoichiometric amine–epoxy thermosets

Curing of off-stoichiometric amine–epoxy thermosets

Simultaneously increasing cryogenic strength, ductility and impact resistance of epoxy resins modified by n-butyl glycidyl ether

Cryogenic properties of hollow glass microsphere/epoxy composites

Contact Info

Product

Resources

About