DOI: 10.3990/1.9789036528559
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Radiation imaging detectors made by wafer post-processing of CMOS chips

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Cited by 5 publications
(9 citation statements)
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“…InGrid production attempts with other materials have consistently shown that aluminum is easier to work with, because of its good adhesion, ductility and ease of wire bonding. Silver and copper seem viable alternatives [34], but these metals are more prone to corrosion.…”
Section: Status Of the Ingrid Microsystemmentioning
confidence: 99%
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“…InGrid production attempts with other materials have consistently shown that aluminum is easier to work with, because of its good adhesion, ductility and ease of wire bonding. Silver and copper seem viable alternatives [34], but these metals are more prone to corrosion.…”
Section: Status Of the Ingrid Microsystemmentioning
confidence: 99%
“…The circuit architecture may be chosen similar to pixel detector readout chips developed for the LHC-experiments ATLAS [39] and CMS [40]. The [34]. The top electrode is electroplated copper with an overall thickness of 5 µm.…”
Section: Status Of the Ingrid Microsystemmentioning
confidence: 99%
“…First we review the device, the technology to construct it and the way it can be combined with readout elements such as CMOS imaging chips. More details can be found in the theses of Max Chefdeville [37] and Victor Blanco Carballo [67]. ese reports introduce the InGrid detector and present the rst results for electron detection and imaging.…”
Section: Chaptermentioning
confidence: 99%
“…Some reports claim that HBs promote cracks [98] others claim that they provide stress relief and can overcome problems with cracks and adhesion [78]. Recent ndings on SU-8 adhesion properties indicate that Hard-Bake steps can have a strong positive effect on adhesion strength [67].…”
Section: In Uence Of Hard-bake Steps On the Dielectric Strength Of Su-8mentioning
confidence: 99%
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