2022
DOI: 10.1109/jestpe.2021.3109395
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Quasi-Distributed Temperature Detection of Press-Pack IGBT Power Module Using FBG Sensing

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Cited by 10 publications
(8 citation statements)
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“…Moreover, they are not commercially attractive due to the set-up complexity and cost of implementation. The three most popular OBS techniques commonly engaged for junction temperature measurement in power switching devices are the TSOP [ 45 ], IRC [ 46 ], and FBG [ 47 ], as highlighted in Figure 1 . Unlike electrical and physical sensing techniques that are invasive to the system, OBS techniques are spatially separated from the sensing circuit and the device, since they operate on light signals.…”
Section: Junction Temperature Optical Sensing Techniquesmentioning
confidence: 99%
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“…Moreover, they are not commercially attractive due to the set-up complexity and cost of implementation. The three most popular OBS techniques commonly engaged for junction temperature measurement in power switching devices are the TSOP [ 45 ], IRC [ 46 ], and FBG [ 47 ], as highlighted in Figure 1 . Unlike electrical and physical sensing techniques that are invasive to the system, OBS techniques are spatially separated from the sensing circuit and the device, since they operate on light signals.…”
Section: Junction Temperature Optical Sensing Techniquesmentioning
confidence: 99%
“…Hence, Equation (10) considers wavelength shift due to the temperature and strain; however, in the case of junction temperature measurement, only the effect of temperature is required. The external strain on the FBG can be eliminated by using a tube or rigid housing, which additionally protects the sensor from mechanical damage [ 47 ]. In this case, Equation (10), can then be rewritten as: …”
Section: Junction Temperature Optical Sensing Techniquesmentioning
confidence: 99%
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“…The vital thermal measurement of interest is commonly the switch junction temperature, where conventional sensing devices, such as TCs and RTDs, are challenged and impractical/impossible to use. FBG size and EMI immunity can offer considerable advantages in this application and provide the ability to monitor further physical measurements of interest [19,[89][90][91][92][93][94][95][96][97]. This is a growing research area with limited work currently available where studies on the direct on-chip FBG sensing applications on standard insulated gate bipolar transistor (IGBT) devices have largely revolved around exploring the possibility of acquiring accurate point temperatures.…”
Section: Multiphysical Sensing Applicationmentioning
confidence: 99%
“…Refs. [90,91] examined the FBG sensor application in a press pack IGBT power module for in-service distributed temperature monitoring. Different sensor layouts, including tube packaged and metal platelet bonded sensors were evaluated, and a good potential of FBG sensors which bonded to the chip surface to enable temperature monitoring, was reported for the emerging press pack chip geometry.…”
Section: Multiphysical Sensing Applicationmentioning
confidence: 99%