Quartz fiber cloth-reinforced semi-aromatic thermosetting polyimide composite with high-frequency low dielectric constant

Abstract

We report a series of semi-aromatic thermosetting polyimide (PI) resins that can be used as matrix for copper-clad laminates for high-frequency applications. The poly(amic ester) (PAE) resins derived from the diester of 1,2,4,5-cyclohexanetetracarboxylic dianhydride, aromatic diamines (the mixture of 2,2′-dimethylbenzidine and 2,2′-bis[4-(4-aminophenoxy) phenyl] propane), and the monoester of nadic anhydride were synthesized by Polymerization of Monomer Reactants (PMR) method. The structure conversion of PAE resins at different temperatures was investigated and the B-stage PI powders prepared by thermally baking the PAE resins at 220°C are nearly fully imidized. The viscosities of the B-stage PI powders and the mechanical and thermal properties of the cured PI resins were optimized by varying the molar ratio of the two diamines. The cured PI resins possess low and steady dielectric constants ( Dk) below 3.0 and dielectric dissipation factors ( Df) of less than 0.01 at high frequency of 1–12 GHz. Furthermore, the quartz fiber cloth-reinforced semi-aromatic thermosetting PI composites (QF/PI) exhibit excellent dielectric performance, good heat resistance, and mechanical properties. At a high frequency of 1–12 GHz, the Dk of QF/PI-4 is stable in the range of 3.16–3.2, and the Df is stable in the range of 0.0026–0.0046. These results suggest the potential of the semi-aromatic QF/PI for use in high-frequency IC boards.

Non-Coplanar Diphenyl Fluorene and Weakly Polarized Cyclohexyl Can Effectively Improve the Solubility and Reduce the Dielectric Constant of Poly (Aryl Ether Ketone) Resin

“…The rapid development of high-frequency communication and large-scale integrated circuits has raised new requirements for interlayer insulating dielectric materials [ 1 , 2 , 3 ]. Insulating dielectric materials are required to have a low dielectric constant and low dielectric loss under high frequency, as well as excellent thermal and mechanical properties, processability, dimensional stability, and low water absorption [ 4 , 5 , 6 ].…”

Thermosetting epoxidized polybutadiene/low‐molecular weight polyphenylene oxide compatible system with quite low‐dielectric constant and loss prepared through co‐curing reaction

“…Therefore, new materials need to be developed for CCLs in high‐frequency applications. So far, the research objects mainly include the modified epoxy resin, cyanate ester (CE), 7,8 polyimide (PI), 9,10 polytetrafluoroethylene (PTFE), 11,12 polyphenylene oxide (PPO) 13,14 and other hydrocarbon resins 15–17 . Among these materials, CE and PI show better dielectric and thermal properties, but higher dielectric loss.…”

Structure‐Property Relationship of Polyimide Fibers with High Tensile Strength and Low Dielectric Constant by Introducing Benzimidazole and Trifluoromethyl Units

“…[ 21 ] However, most PI fibers available on the market possess the relatively high dielectric constant of 3.5. [ 22 ] Since fluorine atoms exhibit strong electronegativity and low electric polarity, it has been recognized as an efficient approach to produce PI fibers possessing a low dielectric constant by introducing trifluoromethyl groups into the polymer chains. [ 23–25 ] Zhang and co‐workers introduced 2,2′‐bis‐(trifluoromethyl)‐4,4′‐diaminobiphenyl (TFMB), a novel fluorinated monomer, to a BPDA/4,4′‐oxydianiline backbone to prepare aerogel with an excellently comprehensive performance.…”