Non-Coplanar Diphenyl Fluorene and Weakly Polarized Cyclohexyl Can Effectively Improve the Solubility and Reduce the Dielectric Constant of Poly (Aryl Ether Ketone) Resin

Bao, Feng; Liu, Yanxing; Shi, Ludi; Cui, Jingze; Ji, Muwei; Liu, Huichao; Yu, Jiali; Zhu, Caizheng; Xu, Jian

doi:10.3390/polym15040962

Cited by 9 publications

(4 citation statements)

References 25 publications

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“…As shown in Figure , we also compared 2F-QNBO with other commonly used dielectric polymers. − Clearly, 2F-QNBO not only shows excellent heat resistance but also exhibits a lower dielectric constant and reduced dielectric loss. In addition, as shown in Figure , it also exhibits very low dielectric constants and dielectric loss at high frequencies.…”

Section: Resultsmentioning

confidence: 99%

Design and Verification of Thermosetting Benzoxazoles with Excellent Dielectric Properties and Thermostability via the Materials Genome Approach (MGA)

Liu,

Duan,

Yin

et al. 2024

ACS Appl. Polym. Mater.

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Dielectric polymer materials with excellent heat resistance, ultralow dielectric constant, and low dielectric loss are widely used in microelectronics and the aerospace industry. Nonetheless, researching these polymers presents a significant challenge as it requires a precise balancing of various performance aspects of the material. In this study, we propose a materials genome approach to designing and screening thermosetting benzoxazole resins that feature excellent dielectric properties and good heat resistance. Candidate structures are initially designed through high-throughput methods based on the materials genome approach and are subsequently screened in two distinct steps. The most promising resin, 2F-QNBO, is first identified theoretically and subsequently verified experimentally. The results indicate that the cured product of 2F-QNBO exhibits a 5% weight loss temperature (T d5 ) of 547 °C. It shows near-constant dielectric constants from 1 to 10 GHz, stabilizing at 1.96 at 10 GHz and demonstrates a slight increase in dielectric loss over this frequency range, reaching 0.0177 at 10 GHz. Overall, it shows good frequency stability over a wide frequency range. It can also be dissolved in common solvents such as tetrahydrofuran and dichloromethane and features good dielectric properties, excellent molding processability, and high-temperature resistance. This study demonstrates the reliability and effectiveness of a high-throughput design and computational screening method grounded in the concept of materials genomics. It presents an approach for developing dielectric polymers with high thermal stability.

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Section: Resultsmentioning

confidence: 99%

Design and Verification of Thermosetting Benzoxazoles with Excellent Dielectric Properties and Thermostability via the Materials Genome Approach (MGA)

Liu,

Duan,

Yin

et al. 2024

ACS Appl. Polym. Mater.

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“…Moreover, the dielectric constant of BPZ‐PC is 2.71 at 1 MHz and the dielectric loss is 0.014. This is attributed to the bulky cyclohexyl groups can increase the free volume of PC molecular chain and reduce the polarization density of PC molecular chain, the molecular chain can no longer be polarized with the frequency change in a short time, and polarization relaxation can be generated, thus the polymer has a lower dielectric constant and dielectric loss 42,43 . This is significant for the specific application of bisphenol‐Z low dielectric special polycarbonate materials in microelectronics and 5G communication.…”

Section: Resultsmentioning

confidence: 99%

Synthesis and properties of bisphenol‐Z polycarbonate via melt transesterification

Han,

Zhang,

Long

et al. 2023

J of Applied Polymer Sci

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Polycarbonate (PC) is a thermoplastic engineering plastic with excellent properties, and its excellent dielectric properties have broad application prospects in the field of electronics. In this paper, bisphenol Z (BPZ) and diphenyl carbonate (DPC) are used as raw materials to synthesize special polycarbonate (BPZ‐PC) by melt transesterification. The effects of catalyst type, catalyst dosage, molar ratio of raw materials, transesterification reaction time and vacuum degree, polycondensation reaction temperature and time on the molecular weight of the product are investigated, and the optimal reaction conditions are obtained. The chemical structure of the product is verified by FTIR, 1H‐NMR and 13C‐NMR spectra tests. The thermal properties, mechanical properties, optical properties and dielectric properties of BPZ‐PC are evaluated. Therefore, due to its excellent performance, BPZ‐PC, a high‐performance low‐dielectric polycarbonate, can be widely used in high‐frequency communication, microelectronics, and aerospace industries.

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“…Due to the increase in voltage and load, the insulation system in transformers has been seriously affected by the difference in permittivity between oil/paper materials, which seriously affects the safety and reliability of equipment in permanent operation. , Consequently, the design and fabrication of low- k dielectric materials are the key to break the “bottleneck” in the development of electronic power systems. Meanwhile, the exploitation of low- k materials has involved multiple industrial areas, such as communication engineering, − integrated circuits, , aerospace, , and autonomous driving instruments (Figure a).…”

Section: Introductionmentioning

confidence: 99%

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration

Dong,

Wan,

Zha

2024

Chem. Rev.

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The development of microelectronics and large-scale intelligence nowadays promotes the integration, miniaturization, and multifunctionality of electronic and devices but also leads to the increment of signal transmission delays, crosstalk, and energy consumption. The exploitation of materials with low permittivity (low-k) is crucial for realizing innovations in microelectronics. However, due to the high permittivity of conventional interlayer dielectric material (k ∼ 4.0), it is difficult to meet the demands of current microelectronic technology development (k < 3.0). Organic dielectric materials have attracted much attention because of their relatively low permittivity owing to their low material density and low single bond polarization. Polyimide (PI) exhibits better application potential based on its well permittivity tunability (k = 1.1−3.2), high thermal stability (>500 °C), and mechanical property (modulus of elasticity up to 3.0−4.0 GPa). In this review, based on the synergistic relationship of dielectric parameters of materials, the development of nearly 20 years on low-k PI is thoroughly summarized. Moreover, process strategies for modifying low-k PI at the molecular level, multiphase recombination, and interface engineering are discussed exhaustively. The industrial application, technological challenges, and future development of low-k PI are also analyzed, which will provide meaningful guidance for the design and practical application of multifunctional low-k materials.

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Non-Coplanar Diphenyl Fluorene and Weakly Polarized Cyclohexyl Can Effectively Improve the Solubility and Reduce the Dielectric Constant of Poly (Aryl Ether Ketone) Resin

Cited by 9 publications

References 25 publications

Design and Verification of Thermosetting Benzoxazoles with Excellent Dielectric Properties and Thermostability via the Materials Genome Approach (MGA)

Design and Verification of Thermosetting Benzoxazoles with Excellent Dielectric Properties and Thermostability via the Materials Genome Approach (MGA)

Synthesis and properties of bisphenol‐Z polycarbonate via melt transesterification

Versatile Landscape of Low-k Polyimide: Theories, Synthesis, Synergistic Properties, and Industrial Integration

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