Quantifying phonon particle and wave transport in silicon nanophononic metamaterial with cross junction

Ma, Dengke; Arora, Anuj; Deng, Song; Xie, Guofeng; Shiomi, Junichiro; Yang, Nuo

doi:10.1016/j.mtphys.2019.01.002

Cited by 67 publications

(52 citation statements)

References 67 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Honarvar and Hussein also examined the effect of temperature . For the 9.78 nm thick membrane with 586.5 nm tall double‐sided nanopillars, a prediction of a factor of 19 reduction in the thermal conductivity was reported at T = 700 K; in contrast to the factor of 130 predicted at T = 300 K. Regarding alloying, Xiong et al demonstrated that one of their silicon wire‐based NPM experiences a factor of slightly less than 3 reduction in k with the resonances effect and an additional factor of nearly 7 by alloying with

50 %

germanium atoms—providing a total reduction of a factor of ≈20 at T = 300 K. Further investigation of rod/wire‐based NPMs has appeared recently …”

Section: Thermal Transport In Nanostructured Membranesmentioning

confidence: 99%

Thermal Conductivity Reduction in a Nanophononic Metamaterial versus a Nanophononic Crystal: A Review and Comparative Analysis

Hussein

Tsai

Honarvar

2019

Adv Funct Materials

View full text Add to dashboard Cite

The notion of a locally resonant metamaterial—widely applied to light and sound—has recently been introduced to heat, whereby the thermal conductivity is reduced primarily by intrinsic localized atomic vibrations rather than scattering mechanisms. This article reviews and analyzes this new emerging concept, termed nanophononic metamaterial (NPM), and contrasts it with the competing concept of a nanophononic crystal (NPC) in which thermal conductivity reduction is realized primarily via nanoscale Bragg scattering. Both the NPM and NPC core mechanisms require the presence of a sufficient level of wave behavior, which is possible when there is a relatively wide distribution of the phonon mean free path (MFP). Silicon serves as a perfect material to form NPMs and NPCs given its relatively large average phonon MFP. This offers a unique opportunity considering silicon's abundance and mature fabrication technology. It is shown in this comparative study that while both the NPM and NPC nanosystems may be rendered to serve as extreme insulators of heat, an NPM may do so without excessive reduction in the minimum feature size–which is key to keeping the electrical properties intact. This trait makes a silicon‐based NPM poised to serve as a low‐cost thermoelectric material with exceptional performance.

show abstract

50 %

germanium atoms—providing a total reduction of a factor of ≈20 at T = 300 K. Further investigation of rod/wire‐based NPMs has appeared recently …”

Section: Thermal Transport In Nanostructured Membranesmentioning

confidence: 99%

Thermal Conductivity Reduction in a Nanophononic Metamaterial versus a Nanophononic Crystal: A Review and Comparative Analysis

Hussein

Tsai

Honarvar

2019

Adv Funct Materials

View full text Add to dashboard Cite

show abstract

“…Phonon particle and wave effects can be quantified by combining MC and atomic Green's function (AGF) methods. 132 To probe phonon transport from the particle standpoint, the MC method can be used for a NCJ system. The transmittance can be used to decide whether phonons can transport across the junction part (Fig.…”

Section: Quantifying Phonon Particle and Wave Transport In 3d Phononimentioning

confidence: 99%

Phonon Transport within Periodic Porous Structures — From Classical Phonon Size Effects to Wave Effects

Xiao¹,

Chen²,

Ma³

et al. 2019

ES Mater.Manuf.

View full text Add to dashboard Cite

ΩSolid angle SubscriptsGPnC SiNW Graphene phononic crystal Silicon nanowire NCJ_MC Nano-cross-junction system with its thermal conductivity calculated by the Monte Carlo method NCJ_AGFMC Nano-cross-junction system with its thermal conductivity calculated by the AGFMC method AbstractTailoring thermal properties with nanostructured materials can be of vital importance for many applications. Generally classical phonon size effects are employed to reduce the thermal conductivity, where strong phonon scattering by nanostructured interfaces or boundaries can dramatically supress the heat conduction. When these boundaries or interfaces are arranged in a

show abstract

“…External thermal energy is transformed to vibration energy in the crystalline materials and transferred to the surrounding atoms. Unlike the pure crystalline materials, the conduction of thermal energy in a polymer can be achieved via a phonon transfer process, as shown in Figure 1 b [ 3 ]. It has been reported that the phonon “transferring” through the phase interface depends on the vibration frequencies of the two phases [ 4 ].…”

Section: Introductionmentioning

confidence: 99%

A Review of Polymer Composites Based on Carbon Fillers for Thermal Management Applications: Design, Preparation, and Properties

et al. 2021

View full text Add to dashboard Cite

With the development of microelectronic devices having miniaturized and integrated electronic components, an efficient thermal management system with lightweight materials, which have outstanding thermal conductivity and processability, is becoming increasingly important. Recently, the use of polymer-based thermal management systems has attracted much interest due to the intrinsic excellent properties of the polymer, such as the high flexibility, low cost, electrical insulation, and excellent processability. However, most polymers possess low thermal conductivity, which limits the thermal management applications of them. To address the low thermal conduction of the polymer materials, many kinds of thermally conductive fillers have been studied, and the carbon-based polymer composite is regarded as one of the most promising materials for the thermal management of the electric and electronic devices. In addition, the next generation electronic devices require composite materials with various additional functions such as flexibility, low density, electrical insulation, and oriented heat conduction, as well as ultrahigh thermal conductivity. In this review, we introduce the latest papers on thermally conductive polymer composites based on carbon fillers with sophisticated structures to meet the above requirements. The topic of this review paper consists of the following four contents. First, we introduce the design of a continuous three-dimensional network structure of carbon fillers to reduce the thermal resistance between the filler–matrix interface and individual filler particles. Second, we discuss various methods of suppressing the electrical conductivity of carbon fillers in order to manufacture the polymer composites that meet both the electrical insulation and thermal conductivity. Third, we describe a strategy for the vertical alignment of carbon fillers to improve the through-plane thermal conductivity of the polymer composite. Finally, we briefly mention the durability of the thermal conductivity performance of the carbon-based composites. This review presents key technologies for a thermal management system of next-generation electronic devices.

show abstract

Quantifying phonon particle and wave transport in silicon nanophononic metamaterial with cross junction

Cited by 67 publications

References 67 publications

Thermal Conductivity Reduction in a Nanophononic Metamaterial versus a Nanophononic Crystal: A Review and Comparative Analysis

Thermal Conductivity Reduction in a Nanophononic Metamaterial versus a Nanophononic Crystal: A Review and Comparative Analysis

Phonon Transport within Periodic Porous Structures — From Classical Phonon Size Effects to Wave Effects

A Review of Polymer Composites Based on Carbon Fillers for Thermal Management Applications: Design, Preparation, and Properties

Contact Info

Product

Resources

About