Atomic Layer Deposition (ALD) is a vapor phase technique which is able to deposit uniform, conformal thin films with an excellent thickness control at the atomic scale. 18 nm thick Al 2 O 3 and TiO 2 coatings were deposited conformaly and pinhole free onto micron-sized Cu powder, using trimethylaluminum (TMA) and tetrakis(dimethylamido)titanium(IV)(TDMAT) respectively as a precursor and de-ionized water as a reactant. The capability of the ALD coating to protect the Cu powder against corrosion was investigated. Therefore the stability of the coatings was studied in solutions with different pH in the range of 0-14, and in-situ raman spectroscopy was used to detect the emergence of corrosion products of Cu as an indication that the protective coating starts to fail. Both ALD coatings provide good protection at standard pH values in the range of 5-7. In general, the TiO 2 coating shows a better barrier protection against corrosion than the Al 2 O 3 coating. However for the most extreme pH conditions, pH 0 and pH 14, the TiO 2 coating starts also to degrade. 1