Pulse plating

Importance of pulse reversal effect of CdSe thin films for optoelectronic devices

“…It is clear that adsorption, desorption as well as recrystallization take place with every new pulses. The main purpose of carrying out pulse reversal plating [5] is to obtain better film thickness with good adherence which in turn will yield higher grain size due to better nucleation sites. As a result, high conversion efficiencies [6] for photoelectrochemical cells fabricated with the usage of these films.…”

Properties of Fe–Ni–Cr alloy coatings by using direct and pulse current electrodeposition

“…), one of the most effective on composition and the resultant properties of the coatings is the applied current. Pulse current (PC) is a modern and interesting alternative to direct current (DC) for improving/modifying the quality of the coating [6][7]. Understanding the pulsating current is possible through many parameters such as peak current density (I p ), average current density (I a ), on time (t on ), off time (t off ), pulse frequency (f) and duty cycle ( ), which show in Fig.…”

“…In recent years, the application of PC to the electrodepositing of alloys has attracted considerable attention and several papers have been published on this subject. The main advantage of the usage of pulse current in alloy electrodeposition, is a better control of the of alloy composition and resultant properties of the coatings [1,[6][7][8][9][10][11]. Despite PC electrodeposition advantages, only one study has been carried out on the pulse electrodepositing of Fe-Ni-Cr alloys [12].…”

Characterization of Nanostructure Black Nickel Coatings for Solar Collectors

“…Considering all studied cases selected for selective solar absorber coating, black nickel plates due to lower consumption of requirement electrical energy also electroplating in large scale for production and development in the industry are considered as one of the most appropriate coatings [4]. There are different methods for the deposition of black nickel coatings, including Chemical vapor deposition (CVD), sputtering, spray pyrolysis [5], electroless [6], pulse plating [7] and electrodeposition [8,9]. Among these methods, because of simple setup, low cost process of coating in industrial scale, easy control of production processes and high speed production, the electroplating method attracted special attention.…”