2020
DOI: 10.1109/jestpe.2019.2935037
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PSpice-COMSOL-Based 3-D Electrothermal–Mechanical Modeling of IGBT Power Module

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Cited by 36 publications
(10 citation statements)
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“…Since 2010, Q‐switched solid‐state lasers based on layered materials including graphene, topological insulators, TMDCs, BP, and g‐C 3 N 4 , have been developed rapidly, as shown in Table . It can be seen that these lasers have excellent performance in output power, pulse width, repetition rate, and peak power.…”
Section: Versatile Pulsed Lasers Using 2d Layered Materialsmentioning
confidence: 99%
See 1 more Smart Citation
“…Since 2010, Q‐switched solid‐state lasers based on layered materials including graphene, topological insulators, TMDCs, BP, and g‐C 3 N 4 , have been developed rapidly, as shown in Table . It can be seen that these lasers have excellent performance in output power, pulse width, repetition rate, and peak power.…”
Section: Versatile Pulsed Lasers Using 2d Layered Materialsmentioning
confidence: 99%
“…In addition, 3‐µm Q‐switched lasers based on layered materials have also been widely studied . Second, besides single‐wavelength operation, multiwavelength Q‐switched lasers have been also developed . As can be seen from Table , multiwavelength Q‐switched lasers at 1 µm, 2 µm or even 3 µm have emerged in recent years.…”
Section: Versatile Pulsed Lasers Using 2d Layered Materialsmentioning
confidence: 99%
“…A major challenge in developing an accurate simulation model for both WBG-based and conventional Si-based power modules is to model electrical mission profiles and dynamics, which are closely related to the device lifetime [2,27]. Moreover, as the switch current profile is studied, real-time circuit analysis must be studied in the simulation [28].…”
Section: Simulation Platformmentioning
confidence: 99%
“…Electrothermal simulation is an effective way to predict device characteristics and various tools have been developed to conduct numerical analyses [21,22]. Among these tools, COMSOL Multiphysics software is capable of modeling and simulating the electrothermal process of semiconductor devices [23][24][25], and thus has been adopted in this study.…”
Section: Introductionmentioning
confidence: 99%