Proposal of a Precision Probe-Tilt Adjustment with the RF Signal Detection Technique

Sakamaki, Ryo; Horibe, Masahiro

doi:10.1109/cpem.2018.8500884

Cited by 8 publications

(5 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Fourth, the deflection required to achieve planarity at the end of the cantilever (due to torsion) is computed using equation (5). Fifth, the overtravel required to achieve planarity at the end of the cantilever (due to torsion) is computed using equation (7). Sixth, the individual overtravel values of each cantilever are computed by adding the overtravel required to achieve planarity to the vertical height of each cantilever before overtravel is imposed.…”

Section: Quantitative Description Using Analytical Modellingmentioning

confidence: 99%

“…One of these challenges is an understanding of the link between the positioning of such probes and their inherent mechanical flexibility. This is particularly important in terms of the impact of positional errors on optimum electrical contact [6]; something that has been studied in rigid commercial probes [7][8][9][10][11][12][13][14]. In contrast, the micromechanical behaviour (bending and twisting) of miniature microcantilever-based probes must be taken into account for optimum probe contacting [15][16][17].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Tilt-related alignment issues in miniature micromechanical on-wafer electrical probes composed of multiple flexible microcantilevers

Arscott

2024

Eng. Res. Express

View full text Add to dashboard Cite

Some new issues concerning the contacting and positioning of small electrical microelectromechanical systems (MEMS) probes based on multiple, flexible microcantilevers are presented here. A tilt error, associated with the lateral probe roll, means that contact touchdown occurs sequentially in different cantilevers upon increasing probe overtravel. To understand the relationship between probe overtravel, tip skate, tip planarity, tip tangency, and contact force in the different contacts, the relationship between mechanical bending and torsion of the flexible cantilevers needs to be accounted for. The study reveals the conditions for achieving contact planarity and desired contact force, as well as the identification of a new ‘differential skate error’ contact misalignment associated with such MEMS probes based on multiple, flexible microcantilevers. This misalignment leads to a ‘differential contact force error’ which has implications for electrical contact quality. An experimental scale model probe based on three cantilevers is used to test the modelling—the results agree well with the predictions of the model. Interestingly, the experiments revealed an effect not accounted for in the modelling; this ‘twist error’ resulted in the cantilever lead edge not being parallel to the touchdown plane. The findings may be useful for engineers involved with the automatic control positioning of such emerging miniature probes, especially in terms of the impact of probe positioning errors.

show abstract

Section: Quantitative Description Using Analytical Modellingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Tilt-related alignment issues in miniature micromechanical on-wafer electrical probes composed of multiple flexible microcantilevers

Arscott

2024

Eng. Res. Express

View full text Add to dashboard Cite

show abstract

“…First, the bending cantilever can be modeled by a solution of the Euler-Bernoulli equation [24]. Second, the roll error angle φ is considered to be small <10 • [12][13][14], such that the torque acting on the corner of the end edge of the cantilever is considered parallel with the contact force which causes the cantilever to deflect. Third, the cantilever only bends in the axial direction, there is no bending of the cantilever in the transverse directiononly warping-as we consider the transverse stiffness to be much greater than the axial/longitudinal direction stiffness.…”

Section: Modelingmentioning

confidence: 99%

“…Position error involving very small signal lines has also been investigated [10], pointing to miniaturization position issues. In addition, the effect of roll error angle on the electrical properties of the rigid probe/contact pad high frequency behavior has been studied [11,12]with innovative solutions being proposed [13,14].…”

Section: Introductionmentioning

confidence: 99%

Quantifying and correcting tilt-related positioning errors in microcantilever-based microelectromechanical systems probes

Arscott

2023

J. Micromech. Microeng.

View full text Add to dashboard Cite

The impact of tilt-related errors on the positioning of microcantilever-based microelectromechanical systems (MEMS) on-wafer electrical probes, having multiple contact pads, is quantified and investigated here. A tilt error associated with probe roll results in the probe contact pads not being parallel to the approaching surface as a downward overtravel is imposed—this leads to one probe pad making contact with the surface before the others. In a MEMS-based probe, the analysis of the impact of roll error angle must consider both the bending and the torsion of the flexible cantilever as the overtravel is increased—something which eventually results in all pads being in contact with the surface, but not with the same contact force. An original mathematical description of the problem is presented. By making some assumptions, the analytical modelling enables the derivation of elegant equations relating the roll error angle and the cantilever deflection to achieve planarity of the cantilever apex with the underlying surface. The modelling predicts probe tip planarity for rectangular and trapezoidal shaped probes. The predictions of the modelling are tested by using macroscopic cantilevers—excellent agreement between modelling and experiment is demonstrated. The macroscopic experimental setup reveals interesting behaviour concerning a bending/twisting, tilted cantilever in contact with—and skating across—an underlying surface. The experimental findings also indicate the pertinence of the modelling for the potential use with understanding the behaviour of microscopic cantilevers—such as MEMS-based probes—similarly in contact with a surface. A flexible microcantilever enables a torsional compensation of the roll error angle. It also enables a protocol where the roll error angle can be corrected. The design geometry of the probe tip will determine which approach is best suited. In principle, the modelling is scalable to MEMS probes composed of silicon-based cantilevers.

show abstract

“…A lot of research has been carried out recently to further improve the accuracy of probe positioning [6] and probe planarity [7], permitting a clear enhancement of measurement accuracy at high frequencies [8]. Automated techniques require a well-calibrated x yz stage and may not be applicable to manual probe stations.…”

mentioning

confidence: 99%

Compensating Probe Misplacements in On-Wafer S-Parameters Measurements

Schmidt

Clochiatti

Mutlu

et al. 2022

IEEE Trans. Microwave Theory Techn.

View full text Add to dashboard Cite

As the maximum frequency of electronics is rising, 1 on-wafer measurements play an important role in modeling 2 of integrated devices. Most of the time, due to the lack of 3 measurement accuracy beyond 110 GHz, such models are usually 4 extracted at frequencies much below their working frequencies 5 and are subsequently extrapolated. The validity of such models is 6 then mostly verified after fabrication of the complete chip, with a 7 simple pass and fail test. This is stating the necessity of enhancing 8 measurement results by any means possible, i.e., to reduce the 9 overall uncertainty in such measurements. It is widely accepted 10 that one of the main sources of uncertainty in such measurements 11 is probe contact repeatability, since it is difficult to reach 12 position accuracy below a few micrometers. We are presenting 13 in this article a method to model the S-parameter variation with 14 probe position on the pads, which can then be used to either 15 estimate contact repeatability uncertainty or further enhance 16 measurement results. The approach is validated based on the 17 measurements performed at 500 GHz. 18 Index Terms-Calibration, on-wafer measurements, probe 19 contact repeatability. 20 I. INTRODUCTION 21 O N-WAFER S-parameters' measurements have the advan-22 tage to characterize on-chip devices without the need 23 for complex waveguide packaging in mm and submm-wave 24 frequencies. In addition, it is a key method for modeling such 25 integrated components, allowing for a much closer evaluation 26 of the manufacturing process, thus improving the overall 27 performance of integrated circuits at these frequencies. The 28 main reason is that the calibration plane is defined directly 29 in the substrate transmission lines. Therefore, it is much 30 closer to the integrated components, without the need to use 31 approximate connector deembedding methods.

show abstract

Proposal of a Precision Probe-Tilt Adjustment with the RF Signal Detection Technique

Cited by 8 publications

References 2 publications

Tilt-related alignment issues in miniature micromechanical on-wafer electrical probes composed of multiple flexible microcantilevers

Tilt-related alignment issues in miniature micromechanical on-wafer electrical probes composed of multiple flexible microcantilevers

Quantifying and correcting tilt-related positioning errors in microcantilever-based microelectromechanical systems probes

Compensating Probe Misplacements in On-Wafer S-Parameters Measurements

Contact Info

Product

Resources

About