Abstract:In this paper, we report on thin film transistors based on gas phase synthesized ZnO nanoparticles using low temperature deposited silicon dioxide and silicon nitride as gate dielectrica. For bottom gate transistors, the devices using silicon nitride as gate insulator show the lowest off-current for a given induced charge and the steepest subthreshold slope. The charge carrier mobility of around 3x10-3 cm2/Vs and an Ion/Ioff ratio of around 105 are almost independent of the insulator material. In a double gate… Show more
“…In order to obtain a more homogeneous particle size distribution, the suspensions were centrifuged resulting in an average particle size of about 25 nm. The production of the suspensions is described elsewhere [10]. In addition, we used the commercially available suspension 30V50 from Klebosol consisting of SiO 2 particles with an average particle size of about 50 nm.…”
Layers of ZnO nanoparticles with thicknesses of about 40 nm were prepared on Si substrates. It was shown that UV laser irradiation is suitable for consolidation and significant densification of the ZnO particle layers under ambient conditions. Both experiments and simulations show that an underlying SiO 2 particle layer has a beneficial effect in inhibiting heat transfer towards the substrate and thus enables the application of temperature-sensitive carrier substrates like polymer foils despite the extremely high melting temperature of ZnO
“…In order to obtain a more homogeneous particle size distribution, the suspensions were centrifuged resulting in an average particle size of about 25 nm. The production of the suspensions is described elsewhere [10]. In addition, we used the commercially available suspension 30V50 from Klebosol consisting of SiO 2 particles with an average particle size of about 50 nm.…”
Layers of ZnO nanoparticles with thicknesses of about 40 nm were prepared on Si substrates. It was shown that UV laser irradiation is suitable for consolidation and significant densification of the ZnO particle layers under ambient conditions. Both experiments and simulations show that an underlying SiO 2 particle layer has a beneficial effect in inhibiting heat transfer towards the substrate and thus enables the application of temperature-sensitive carrier substrates like polymer foils despite the extremely high melting temperature of ZnO
“…These materials are compatible with a range of growth and deposition techniques, and with associated patterning options, thereby enabling selective application to desired regions of a substrate. Previous studies demonstrate uses of such materials in capacitors, , transistors, , interlayers, , passivation coatings, and barriers against water permeation. ,, Bioresorption occurs under physiological conditions via hydrolytic processes. Silicon oxide and silicon nitride deposited by plasma-enhanced chemical vapor deposition (PECVD) represent good choices for inorganic materials-based encapsulation .…”
Section: Materials For Bioresorbable Electronicsmentioning
confidence: 99%
“…SiO 2 , Si 3 N 4 , and MgO are useful in bioresorbable capacitors as insulators and in transistors as gate dielectrics. For fabrication of bioresorbable p- and n-type metal oxide semiconductor field-effect transistors (MOSFETs), Si NM (300 nm thick); SiO 2 , Si 3 N 4 , and MgO (<200 nm thick); and Mg (300 nm thick) can be used for channels, gate dielectrics, and electrodes, respectively. ,,, Bioresorbable capacitors with these materials use conventional metal–insulator–metal structures. Recent applications of inorganic dielectric materials as insulators with corresponding dielectric constants (3.7–3.9 for SiO 2 ; 7.5 for Si 3 N 4 ; 9.8 for MgO) are in structures of Mg/SiO 2 /Mg and Mg/MgO/Mg. , …”
Section: Materials For Bioresorbable Electronicsmentioning
Transient electronic systems represent an emerging class
of technology
that is defined by an ability to fully or partially dissolve, disintegrate,
or otherwise disappear at controlled rates or triggered times through
engineered chemical or physical processes after a required period
of operation. This review highlights recent advances in materials
chemistry that serve as the foundations for a subclass of transient
electronics, bioresorbable electronics, that is characterized by an
ability to resorb (or, equivalently, to absorb) in a biological environment.
The primary use cases are in systems designed to insert into the human
body, to provide sensing and/or therapeutic functions for timeframes
aligned with natural biological processes. Mechanisms of bioresorption
then harmlessly eliminate the devices, and their associated load on
and risk to the patient, without the need of secondary removal surgeries.
The core content focuses on the chemistry of the enabling electronic
materials, spanning organic and inorganic compounds to hybrids and
composites, along with their mechanisms of chemical reaction in biological
environments. Following discussions highlight the use of these materials
in bioresorbable electronic components, sensors, power supplies, and
in integrated diagnostic and therapeutic systems formed using specialized
methods for fabrication and assembly. A concluding section summarizes
opportunities for future research.
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