Properties of resistive thick films based on powdered Sn0.9Sb0.1O2 and obtained by heat treatment in nitrogen

Dyshel, D. E.; Blank, K.; Ainshtein, R. G.

doi:10.1007/bf00559574

Cited by 2 publications

(3 citation statements)

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“…To circumvent the often observed processing issues with nitrogen firing TFRs, [183][184][185][186][187][188][189]190,506 air firing systems should be developed. Several promising studies using molybdenum oxides have been carried out towards this goal, [507][508][509][510][511][512] with the most recent embodiment 512 having achieved transition to a bismuth glass frit, paving the way to low cost lead free resistors.…”

Section: Glasses For Tfrsmentioning

confidence: 99%

“…Lead free glasses were widely used in the 1970s to 1980s, including for resistors, due to the then considerable development of nitrogen firing TF systems. [183][184][185][186][187][188][189] However, these materials have largely fallen into disfavour, due mainly to performance and reliability problems, especially in ensuring proper organic vehicle burnout. 190 While 'lead free' is an important aspect in the present review, glasses containing both Bi 2 O 3 and PbO are also included, as they are relevant for specialised applications.…”

Section: Main Performance Criteriamentioning

confidence: 99%

“…A more long term potential development would be the avoidance of costly precious metals, by using other metallic (or almost metallic) oxides and compounds as conductive phases, of which a very wide variety exists, 490 or metal borides, silicides, etc. To circumvent the often observed processing issues with nitrogen firing TFRs, [183][184][185][186][187][188][189]190,506 air firing systems should be developed. Several promising studies using molybdenum oxides have been carried out towards this goal, [507][508][509][510][511][512] with the most recent embodiment 512 having achieved transition to a bismuth glass frit, paving the way to low cost lead free resistors.…”

Section: Glasses For Tfrsmentioning

confidence: 99%

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Review of Bi₂O₃ based glasses for electronics and related applications

Maeder

2013

International Materials Reviews

146

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The present work critically reviews the scientific and patent literature on low melting bismuth based oxide glass frits in materials for electronics, sensors and related applications such as sealing glasses, solar cells, architectural and automotive glass, the main motivation being to replace lead based materials by environmentally more benign ones. Due to similar glass forming properties of Bi and Pb, Bi based glasses are the closest 'drop-in' alternative for lead bearing formulations, and are therefore actually replacing them in many applications, helped also by previous experience with Bi containing materials in thick film technology and component metallisations. The outstanding issues are discussed, e.g. matching the lowest processing temperatures achieved by the classical lead based glasses without sacrificing durability and stability, as well as stability versus chemical reduction. Finally, consideration is also given to special 'heavy' glasses (often containing Bi and Pb together) that are useful in fields such as optics, superconductors and nuclear technology, as well as to specific Bi 2 O 3 containing crystalline compounds.Keywords: Glasses, Bismuth, Bi 2 O 3 , Electronics, Optics, Thick film technology, Sensors Introduction Low melting glasses in electronics and other applicationsAs for ceramics, inorganic glasses, glass-ceramic and glaze materials have long gone beyond their traditional uses to address a wide array of modern technological challenges, Owing to performance and cost criteria, most standard glasses have relatively high softening points. However, there are many technological applications where a low softening temperature is required, in order to lower energy expenditure, avoid damaging devices in contact with the glass during processing or ensure compatibility with other materials:(i) hermetic sealing of packages, lamps, electrical feedthroughs and semiconductor devices 13,14,16,17,19,44,45 (ii) hermetic sealing and mechanical attachment of sensors 23,27 ( Fig. 1) (iii) encapsulation of semiconductor devices 29,30 (iv) overglazing of automotive, packaging and architectural glass 33,34,[46][47][48] (v) photovoltaic (PV) solar cell technology -conductors and contacts 42,43,[49][50][51][52][53] (vi) enamelling of aluminium in architecture and home appliances 35,[54][55][56][57][58] (vii) thick film (TF) electronics and other devices 21,22,24,25,27,59 (Fig. 1, the section on 'PbO in low melting frits and TF technology'); especially, special low firing compositions for fabrication of circuits and sensors on glass or metals. 1,28,[66][67][68][69][70][71][72] For these applications, glasses are often formulated as frits (e.g. finely divided powder), which may be applied, dispersed in a suitable medium, onto a substrate by various methods such as slip casting, screen printing, roller/curtain coating, spraying, dispensing and electrophoresis, or as preforms for sealing. Classically, the aforementioned applications have to a great extent used lead based glasses, which have a rather unique combinat...

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