Properties of low melting point Sn–Zn–Bi solders

Zhou, Jian; Yangshan, Sun; Xue, Feng

doi:10.1016/j.jallcom.2004.12.052

Cited by 128 publications

(54 citation statements)

References 9 publications

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“…The data found for Sn-Bi-Zn alloy, are consistent with those found in the literature for Sn-Zn-Bi alloys [17,18] since no mechanical results are reported for alloys with compositions equal to that chosen in this research. Lower ultimate tensile strengths (UTS) were found in the case of SAC alloy samples, according to the literature [16].…”

Section: Mechanical Testssupporting

confidence: 92%

Electrochemical and mechanical behaviour of Sn‐2.5Ag‐0.5Cu and Sn‐48Bi‐2Zn solders

Montesperelli

Rapone

Nanni

et al. 2008

Materials & Corrosion

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In this paper, two tin-based alloys (Sn-2.5Ag-0.5Cu and Sn-48Bi-2Zn) are proposed as new lead-free solders. Alloys have been developed by melting pure elements. Samples have been evaluated in terms of microstructure, corrosion resistance and mechanical features. Corrosion tests have been performed in 3% NaCl solution by polarization curves and electrochemical impedance spectroscopy (EIS). SEM observations and EDS analysis were carried out on samples before and after corrosion tests. Static monotonic tensile tests have been performed on three specimens for each alloy. SEM and EDS analysis revealed the presence of Sn-Ag and Sn-Cu intermetallic compounds within the Sn-Ag-Cu alloy. As a result of corrosion test, the Sn-Ag-Cu alloy showed a better corrosion resistance with respect to Sn-Bi-Zn. Both alloys evidenced good mechanical properties higher than the traditional Sn-Pb system. Sn-Ag-Cu seems to be a suitable soldering material

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Section: Mechanical Testssupporting

confidence: 92%

Electrochemical and mechanical behaviour of Sn‐2.5Ag‐0.5Cu and Sn‐48Bi‐2Zn solders

Montesperelli

Rapone

Nanni

et al. 2008

Materials & Corrosion

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“…If the mushy temperature zone is wide, this indicates that alloys exist as part liquid for a long time during solidification and cannot form reliable joints in the soldering process. 18 Huang found that the onset point in the DSC heating curve represents the solidus temperature, and that the peak point shows the liquidus temperature. 19 As can be seen in Table II, the melting temperature of the solder for Sn-58Bi-0.1RE and Sn-58Bi-0.5Ag-0.1RE are, respectively, 139.7°C and 139.1°C.…”

Section: Melting Temperaturementioning

confidence: 99%

Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy

Dong

Shi

Xia

et al. 2008

Journal of Elec Materi

110

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The effect of trace amounts of rare earth additions on the microstructure and properties were studied for the Sn-58Bi and Sn-58Bi-Ag solder alloys. At the same time, the intermetallic compounds (IMCs) in the solder alloys and intermetallic layer (IML) thickness at the solder/Cu substrate interface were investigated, both as-reflowed and after high-temperature aging. The results indicate that adding trace amounts of rare earth (RE) elements has little influence on the melting temperature and microhardness of the solders investigated, but adding RE elements improves the wettability and shear strength of the Sn-58Bi and Sn-58Bi-Ag solder alloys. In addition, it was found that the addition of RE elements not only refines the microstructure and size of the IMC particles, but also decreases the IML thickness and shear strength of the Sn-58Bi solder joint after high-temperature aging. Adding trace amounts of RE elements is superior to adding trace amounts of Ag for improving the properties of the Sn-58Bi solder. The reason may be related to the modification of the microstructure of the solder alloys due to the addition of trace amounts of RE elements.

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“…Moreover, Bi is a surface active element and can reduce surface tension and eutectic temperature of the Sn-Zn system. So it has been added to the Sn-Zn alloy to form the ternary eutectic Sn-8Zn-3Bi with improved wettability and lower melting point [16,17].…”

Section: Introductionmentioning

confidence: 99%

Correlation between Zn-Rich Phase and Corrosion/Oxidation Behavior of Sn–8Zn–3Bi Alloy

Zhang

Gao

et al. 2016

Metals

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Abstract:The microstructure of Sn-8Zn-3Bi alloy was refined by increasing the solidification rate and the correlation between Zn-rich phase and the corrosion/oxidation behavior of the alloy was investigated. The Zn-rich phase transforms from coarse flakes to fine needles dispersed in the β-Sn matrix with the increase of the cooling rate. The transformation of Zn-rich precipitates enhances the anticorrosive ability of Sn-8Zn-3Bi alloy in 3.5 wt.% NaCl solution. On the contrary, Sn-8Zn-3Bi alloy with a fine needle-like Zn-rich phase shows poor oxidation resistance under air atmosphere, due to the fast diffusion of Zn atoms in Sn matrix.

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Properties of low melting point Sn–Zn–Bi solders

Cited by 128 publications

References 9 publications

Electrochemical and mechanical behaviour of Sn‐2.5Ag‐0.5Cu and Sn‐48Bi‐2Zn solders

Electrochemical and mechanical behaviour of Sn‐2.5Ag‐0.5Cu and Sn‐48Bi‐2Zn solders

Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy

Correlation between Zn-Rich Phase and Corrosion/Oxidation Behavior of Sn–8Zn–3Bi Alloy

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