2003
DOI: 10.1590/s1516-14392003000100007
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Properties of amorphous SiC coatings deposited on WC-Co substrates

Abstract: In this work, silicon carbide films were deposited onto tungsten carbide from a sintered SiC target on a r.f. magnetron sputtering system. Based on previous results about the influence of r.f. power and argon pressure upon the properties of films deposited on silicon substrates, suitable conditions were chosen to produce high quality films on WC-Co pieces. Deposition parameters were chosen in order to obtain high deposition rates (about 30 nm/min at 400 W rf power) and acceptable residual stresses (1.5 GPa). A… Show more

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Cited by 13 publications
(6 citation statements)
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“…This amounts to a deposition time of 27 min for a 2-μm-thick film. This deposition rate is higher than those reported previously for RF sputtered SiC (18-30 nm/min) [25], [36], [37] and dc sputtered SiC (30 nm/min) [26].…”
Section: Synthesis Of Silicon Carbide Thin Filmscontrasting
confidence: 54%
See 1 more Smart Citation
“…This amounts to a deposition time of 27 min for a 2-μm-thick film. This deposition rate is higher than those reported previously for RF sputtered SiC (18-30 nm/min) [25], [36], [37] and dc sputtered SiC (30 nm/min) [26].…”
Section: Synthesis Of Silicon Carbide Thin Filmscontrasting
confidence: 54%
“…a-SiC films can be deposited from an electrically insulating SiC target using RF magnetron sputtering, but previous reports indicate relatively low deposition rates of 18-30 nm/min at room temperature for these films [25], [36], [37]. Thus, none of the existing options satisfy all of the criteria necessary to implement a stress-controlled CMOScompatible deposition process.…”
Section: Synthesis Of Silicon Carbide Thin Filmsmentioning
confidence: 99%
“…A growth rate of 75 nm/minute was achieved at a deposition power of 2 kW. This is significantly higher than the 18-30 nm/min reported for a-SiC RF sputtering [17,18].…”
Section: Details Of Deposition and Etching Characterization Of Sic Thin Filmsmentioning
confidence: 64%
“…Another viable strategy is the deposition of intermediate layers, acting as diffusion barriers for Co and minimizing effects from the thermal expansion difference. Among several possible interlayers cited in the literature, silicon carbide (SiC) is pointed as one of the best options for such application 7,[10][11][12][13][14][15][16][17][18][19][20] . SiC is extensively used in abrasive tools, ceramics, insulation, metallurgical applications, refractories, and wear resistant materials, and this is due to its superior properties, including wide bandgap, low density, low thermal expansion, excellent thermal shock/oxidation/chemical resistance, high hardness, and high thermal conductivity 18,21 .…”
Section: Introductionmentioning
confidence: 99%