2004
DOI: 10.1063/1.1635996
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Properties and origins of different stacking faults that cause degradation in SiC PiN diodes

Abstract: The electrical degradation of 4H–SiC PiN diodes has recently attracted much interest and is a critical material problem for high power applications. The degradation is caused by stacking faults observed as an increased forward voltage drop after forward injection operation. In this article we have combined electrical, optical, and structural techniques to study the formation and growth of the stacking faults causing degradation. We will show three different sources causing two different types of stacking fault… Show more

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Cited by 92 publications
(88 citation statements)
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“…The number for each SF indicates how many times it appeared in the TEM measurements. Similarly, from HR-TEM images, Liu et al found the SFs in 6H-SiC with the faulted sequences of (3,2), (3,4), (3,5), (3,6), and (3,2,2,2), 13 which are also including in Table I. This indicates that all the SFs we observed are not specific in this 6H-SiC sample.…”
Section: B Hr-tem Images Of Stacking Faultssupporting
confidence: 55%
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“…The number for each SF indicates how many times it appeared in the TEM measurements. Similarly, from HR-TEM images, Liu et al found the SFs in 6H-SiC with the faulted sequences of (3,2), (3,4), (3,5), (3,6), and (3,2,2,2), 13 which are also including in Table I. This indicates that all the SFs we observed are not specific in this 6H-SiC sample.…”
Section: B Hr-tem Images Of Stacking Faultssupporting
confidence: 55%
“…5. Apart from SFs (3,4) and (4,4), several stacking faults in sequences of (3,5), (3,6), (3,7) can also be observed. At the bottom of Fig.…”
Section: B Hr-tem Images Of Stacking Faultsmentioning
confidence: 99%
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